In recognition of their significant contributions of time and talent and ongoing leadership in IPC and the industry, Karen McConnell, Northrop Grumman, and Linda Woody, Lockheed Martin, earned IPC Presidents Awards at IPC APEX EXPO® in San Diego.
Karen McConnell first became familiar with the IPC standards development process when she worked for UNISYS on PCB design verification. IPC-D-275, Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies became her well-thumbed resource for design and verification of manufacturing data. Her first foray into the realm of IPC committee work began when she became a member of the 2-10 Electronic Product Data Description Committee.
McConnell became more active on IPC committees during her tenure with the Lockheed Martin Engineering Process Improvement Center where she worked from 1996 to 2010. She supported the PWB Working Group which had a very organized approach to supporting IPC standards committees. Part of her duties at that time was to attend meetings and provide a Lockheed Martin voice when her colleagues had scheduling conflicts. This provided McConnell with a sort of cross pollination of IPC committee work.
When she joined Northrop Grumman in 2010, she was able to continue serving on IPC standards committees. McConnell is currently a member of the IPC Designers Council and serves on IPC’s 2-30 Terms and Definitions Committee as well as the 5-21f Ball Grid Array Task Group. McConnell chairs several IPC committees including the 2-10 Committee, 2-40 Electronic Documentation Technology Committee and 1-13 Land Pattern Subcommittee. In addition, she is a member of the IPC Technical Activities Executive Committee and the IPC Committee Chairman Council.
Another IPC Presidents Award recipient, Linda Woody has supported IPC’s standardization efforts for more than 18 years and made her first technical presentation in 1997 on behalf of IPC. Since then, she has served on 21 IPC committees, chaired the 2-18d Printed Board Declaration Task Group and currently serves as Chair of the 2-18e Assembly Technology Declaration Task Group. Woody not only has a direct hand in drafting IPC documents, but also has participated in numerous round robin testing programs to collect data to support the requirements within the documents.
In 2012, Woody served as conference co-chair for the IPC Tin Whiskers Conference and gave the keynote address on the state of lead-free and its impact on the printed board industry. For her efforts, she has earned nearly a dozen committee service awards.
“IPC and the entire electronic interconnect industry are fortunate to have Karen and Linda contributing their time and expertise to IPC standards and program development. Their work has enriched both IPC and industry,” said John Mitchell, IPC president and CEO.
For more information on the IPC Presidents Award and this year’s recipients, contact Anna Garrido, IPC director of marketing and communications at +1 847-597-2804.
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.