Machine Vision Products to demo advanced applications and new systems at IPC APEX EXPO 2013
Carlsbad, CA – February 15, 2013: Machine Vision Products (MVP), a leader in Automated Optical Inspection will be demonstrating an expanded applications toolbox as well as introducing new AOI technologies at the IPC APEX EXPO 2013 in San Diego from February 19 to 21.
MVP is also celebrating 20 years of being the leading innovator of AOI technology. Founded in 1993 Machine Vision Products has developed a number of industry firsts, which have been adopted as standards within our industry.
During the past 12 months MVP has continued to push the boundaries of performance, speed and ease of use to a new level across all their AOI platforms. MVP has introduced new systems and new hardware including faster multiprocessor technology, new higher resolution cameras, and new lighting.
New software development includes powerful pattern recognition algorithms with synthetic image support, enhanced lifted lead detection, solder ball inspection, 3d point sensor support and topside/bottomside support with board flipper capability. Our powerful new AutoNetworker and DPC Lite products provide traceability and powerful webreporting options.
MVP is demonstrating these advances along with new applications and product introductions throughout the IPC APEX EXPO.
As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems. MVP will be exhibiting at Booth #427.
Introducing the new Selecta
The Selecta is a brand new platform developed by MVP to serve the Selective Solder and Wave Solder processes. The Selecta will be unveiled at the IPC APEX EXPO.
With a substantial amount of backplane and Wave Solder processes in use in many facilities, MVP now provides a dedicated system to serve this type of process.
The Selecta is based on the same core technology as MVP use for their advanced SMT technologies. However, the Selecta is a “look up” system where imaging is performed on the underside of the PCB assembly.
Capable of inspecting up to 18x14 inch (450x350mm) boards the system is configured with a high powered 64 bit operating system, up to 16 cores of processing power and 12 Megs of memory to tackle even the most complex inspection requirements.
The Selecta includes MVP’s latest ease-of-use software and includes options for automatic database generation from a variety of input sources without the need for 3rd party data translators.
The new Supra E
The latest Supra E AOI provides the best cost to performance ratio for any AOI system.
The Supra E can now be optionally upgraded to a 64 Bit operating system, 16 cores of processing power and 12 Meg of memory the and is more powerful and faster than ever before.
The Supra E is capable of inspecting 20x20 inch (508x508mm) boards the system utilizes MVP’s latest ease-of-use software and includes options for automatic database generation from a variety of input sources without the need for 3rd party data translators. As with all of MVP’s inline SMT focused AOI solutions, the Supra E comes standard with a true 10 micron pixel resolution for inspection of components as small as 01005, with full solder inspection.
MVP 850G and Microelectronics Applications
The MVP 850G is a multiple award winning AOI system dedicated to Microelectronics applications.
The 850G can be configured for Lot Solutions including MVP’s own Magazine Lifters/Indexers, Jedec Trays, Waffle Packs, and Auer Boats.
Handling solutions can now also be configured to provide tray/pallet flipping to allow inline, double sided inspection.
MVP’s inline solutions allow for both single and dual lane processing, and strip handling. MVP also provide custom handling solutions.
The 850G is flexible within multiple locations of microelectronics and packaging lines. For Lead Frame processes the Ultra 850G can be placed Post Die Bonder, Post Wire Bonder or Post Solder Ball Attach. With resolution and repeatability a critical factor, the Ultra 850G can be configured to provide a 1um pixel size.
During the IPC APEX EXPO, MVP will demonstrate inspection of BGA technology including BGA Tilt and Flip Chip Tilt as well as a selection of other Microelectronics applications.
The Ultra SPI
The Ultra SPI is MVP's latest Solder Paste Inspection system utilizing MVP's leading Gerber and CAD generation utilities. Capable of importing Gerber and design data MVP can produce a 3D inspection database within a matter of 5-10 minutes.
The Ultra SPI model’s dual smart 3D cameras inspect paste deposits for multiple defect scenarios.
A feature rich set of graphical data output is also available providing the user with a visual representation of defect analysis.
The Ultra SPI is the world’s only full 2D/3D capable AOI machine. This dual capability configuration provides a complete line inspection solution. It can inspect boards immediately after the printer for true volumetric measurement of paste deposits, it can then inspect after the pick and place machine for pre-reflow inspection and then after the oven for industry leading post reflow inspection. This capability is performed while using a patented 3D inspection methodology for paste inspection, which removes shadowing and specular noise.
For additional information on MVP, please visit us at www.machinevisionproducts.com or visit us at booth number 427 at APEX where we can discuss your application requirements.
For further information contact:
Phone: 1-800-260-4MVP or +1-760-438-1138
About Machine Vision Products, Inc.
Machine Vision Products is a market innovator and leader in imaging technologies for Surface Mount, Microelectronics and Packaging Technologies. Machine Vision Products provide solutions for both commercial and military applications. Machine Vision Products operate globally with direct operations in the US, China, Malaysia and the UK, with additional representation in countries throughout North America, Europe and Asia.