TMV the Second Generation of PoP

Jan 19, 2013

TMV Shorts on Bob Willis Tests using DAGE X-Ray

TMV Shorts on Bob Willis Tests using DAGE X-Ray

Package on Package Assembly Inspection & Quality Control is the first text book covering every step in this exciting manufacturing and design lead technology. Recent trials on the use of TMV are covered along with experiments on the ability to clean these packages and conformal coat. This book is the second publication written by Bob Willis as a free download, his first on Pin In Hole Intrusive Reflow has been read by over 3000 engineers worldwide.

Further details and content of this eBook can be obtained from its dedicated website http://www.packageonpackagebook.com

Package On Package will be launched at IPC APEX Expo, San Diego with pre-registration now at http://PackageOnPackagebook.com

The book contains over 100 pages, 16 sections, diagrams, colour images and x-rays

Join Bob and the NPL Team on the Cleaning and Contamination Testing Center stand 1549 at APEX or on one of his workshops in San Diego

You must be a registered user to talk back to us.

More News from ASKbobwillis.com

Nov 10, 2016 -

NPL Future of Interconnection Reliability - The Way Forward

Nov 04, 2016 -

Robotic Iron & Laser Soldering for Lead-Free & High Temperature Alloys webinar

Oct 21, 2016 -

Online Soldering Webinars for All

Sep 06, 2016 -

New NPL Method for Testing Reliability of Electronics in Condensing Environment FREE Webinar

Aug 19, 2016 -

Your Guide to Process Defect of the Month

Aug 12, 2016 -

Solder Paste Inspection, QC & Defect Photos

Aug 11, 2016 -

High Temperature Soldering

Aug 03, 2016 -

Online or Onsite Hands on Workshops - No One Offers More Choice

Aug 02, 2016 -

Shine the Light On LED Technology with Bob Willis

Jul 10, 2016 -

Soldering Support Online or On Site

(48) more news from ASKbobwillis.com

TMV the Second Generation of PoP news release has been viewed 731 times

Precision Auger Dispense Pump

Fluid Dispense Pump Integration