Package on Package Assembly Inspection & Quality Control is the first text book covering every step in this exciting manufacturing and design lead technology. Recent trials on the use of TMV are covered along with experiments on the ability to clean these packages and conformal coat. This book is the second publication written by Bob Willis as a free download, his first on Pin In Hole Intrusive Reflow has been read by over 3000 engineers worldwide.
Further details and content of this eBook can be obtained from its dedicated website http://www.packageonpackagebook.com
Package On Package will be launched at IPC APEX Expo, San Diego with pre-registration now at http://PackageOnPackagebook.com
The book contains over 100 pages, 16 sections, diagrams, colour images and x-rays
Join Bob and the NPL Team on the Cleaning and Contamination Testing Center stand 1549 at APEX or on one of his workshops in San Diego