Viscom today announced plans to debut the new S6056 XM AOI system with new 65 MegaPixel ultra-high-speed camera head in booth #3133 at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California.
Viscom’s new XM camera head offers highest resolution with ultra fast color image acquisition from top-down and eight angular views, cutting inspection time in half.
Also on display, Viscom’s S3088 inspection platform was developed to combine efficiency and user-friendliness. It was designed to bring high-reliability inspection capability with ease-of-programming features to the market. All of these attributes and more are now available on the new S3088 AOI and S3088 3-D SPI machines.
The X7056RS in-line X-ray inspection system can be used both as a pure in-line X-ray inspection setup and a combined system with a full AOI. The pronounced inspection depth of the tried and tested Viscom AOI systems is achieved via the integration of the optical 8M sensor technology, orthogonal or angled. With the OnDemandHR function, the AOI resolution can be flexibly switched over from 23.4 to 11.7 µm/pixel with the full image field size. In the angled view, a range of 16.1 µm/pixel to 8.05 µm/pixel is possible.
Another highlight at the show – Viscom’s new SPI-AOI Uplink feature enables the use of information later in the process to ensure post-reflow defect detection while allowing high variability of the paste print process. SPI measurement data is not only used to classify paste print but also provides the information to the post-reflow AOI inspection via Viscom’s unique SPI-AOI Uplink interface.
Other special Viscom features to be highlighted at the show include vVision, SPC, an entire suite of applications providing all available process data where it is needed, and a programming and rework station. For more information, stop by booth #3133 at the IPC APEX EXPO or visit www.viscom.com.