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Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 16, 2013

Finetech will highlight the FINEPLACER® core rework system in booth #1205 at the upcoming IPC APEX EXPO, scheduled for February 19-21, 2013 at the San Diego Convention Center in California.

The FINEPLACER® core offers proven rework technology for a wide spectrum of SMT components, ranging in size from 0201 to 70 x 70 mm BGAs, and handling PCBs up to 310 x 400 mm. The semi-automated design includes force measurement with automatic component lift-off and placement. A real time process observation camera allows the ability to view the reflow process at almost any angle. The FINEPLACER® core represents a compact, yet versatile hot-gas rework system withs a level of professionalism that exceeds its attractive price.

The system integrates the complete rework cycle into an efficient design without diminishing functionality.The FINEPLACER® core handles de-soldering, site dressing/solder removal, paste print, re-balling and component replacement in one integrated platform. Driven by sophisticated integrated thermal management and the new QuickStart Profile Library, the FINEPLACER® core provides more for less.

For more information, visit Finetech booth #1205 at the IPC APEX EXPO or visit www.finetechusa.com.


Finetech is a leading manufacturer of equipment for high-precision bonding and die attach and manual to fully automatic component rework. T he company services customers in a broad range of industries including aerospace, medical technology, consumer electronics, semiconductor, optoelectronics, military, universities and research.  Finetech offers a flexible approach to customer support and welcomes the opportunity to create customized, effective solutions.  Corporate headquarters and main production are in Berlin, Germany.  Sales and Technical support centers are located in Gilbert, Arizona; Manchester, New Hampshire; Shanghai, China and Kuala Lumpur, Malaysia.
 

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