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MIRTEC to Exhibit Complete Line of 3D AOI, SPI and LED Inspection Systems at IPC APEX 2013

Jan 16, 2013

 MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI and LED Inspection Systems at IPC APEX 2013 booth #3217.  This three-day event will be held at the San Diego Convention Center from February 19-21st.

We at MIRTEC are very excited to present our award winning MV-9 2D/3D In-Line AOI Machine at APEX 2013,” stated Brian D’Amico, President of MIRTEC Corp.  “This Technologically Advanced AOI machine is configured with MIRTEC’s revolutionary OMNI-VISION® 3D Inspection Technology which combines our exclusive 15 Mega Pixel 2D ISIS Vision System with our revolutionary Digital Multi-Frequency Quad Moiré 3D system to provide precision inspection of SMT devices on finished PCB assemblies.  Fully configured the new MIRTEC MV-9 machines will also feature four (4) Ten Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera.

MIRTEC also will exhibit an MV-7xi In-Line AOI System configured with one Top-Down View Ten Mega Pixel camera with a Precision 13.4 Micron Telecentric Compound Lens and four (4) Ten Mega Pixel Side-View Cameras. The MV-7xi features a 2D camera bar code reader, a high-throughput, three-stage PCB conveyor and a PCB under board support system. The system also will be configured with MIRTEC’s exclusive Intelli-Scan Laser System providing superior lifted lead detection for gull wing devices, four-point height measurement capability for co-planarity testing of BGA and CSP devices, and enhanced solder paste measurement capability.

The MIRTEC MS-11 In-Line SPI System uses Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste deposition on PCBs post screen print. The MS-11 will inspect for; insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. New at IPC APEX 2011, the MS-11 will be configured with the 15M pixel ISIS Vision System for enhanced image quality, superior accuracy and lightning fast inspection rates. The MS-11 uses the same robust platform as MIRTEC’s MV-7 Series. Inspection heads are interchangeable between the two systems, adding ultimate flexibility to the inspection process. 

MIRTEC’s MV-9UP LED Inspection System uses our exclusive 2D/3D Technology for inspection of LED packages after the encapsulation portion of the LED manufacturing process where an epoxy lens is formed to seal and support the electronic components.  The MV-7UP uses 2D inspection to detect foreign materials and bubbles within the epoxy. 3D inspection is used to provide a volumetric measurement of the epoxy encapsulant.

The MIRTEC MV-3L Desktop AOI System is the industry’s most widely accepted five camera desktop AOI system.  This system is configured with one Top-Down View Ten Mega Pixel camera with a Precision 13.4 Micron Telecentric Compound Lens and four (4) Ten Mega Pixel Side-View Cameras. It also features the Intelli-Beam Laser System. This advanced technology provides: four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability.

MIRTEC’s new MV-2GT Desktop AOI System was developed to provide “World Class” MIRTEC Advanced Technology to the Electronics Manufacturing Industry at an affordable price.  This system is based on our award winning MV-2 Desktop AOI Series with an installed base of several thousand machines still in operation today!.  Backed by our industry acclaimed global support organization the newly redesigned MV-2GT is configured with a single Top-Down 5 Mega Pixel Digital Color Camera System, Auto Clamp PCB Workholder and a three stage LED Lighting System.  These systems offer superior fault coverage and will detect defects such as component presence/absence, polarity, miss alignment, insufficient solder, solder bridging, etc.  The system software is very powerful yet extremely simple to use. The standard SPC software package promotes continuous process improvement by allowing the user to track and eliminate defects on inspected assemblies.

At the booth, visitors can learn more about MIRTEC’s total quality management system software, Intellisys. The software suite promotes continuous process improvement by allowing the manufacturers to track and eliminate defects on inspected assemblies.

MIRTEC has earned a solid reputation in the industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment,” continued D’Amico, “We look forward to welcoming visitors to our booth #3217 during the three day event.”



MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry.  For further information, please visit www.mirtec.com.

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