AIM Solder announces that it will highlight its new NC277 No-Clean Liquid Flux at the upcoming IPC APEX Expo, booth #1302, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California.
NC277 Liquid Flux is formulated to offer a very wide process window and is excellent in extended dwell times. NC277 offers a broad activation range, proving to be an excellent flux for a variety of process parameters and applications, including lead-free wave soldering with tin-silver-copper, tin-silver, tin-copper, and other alloys.
NC277 offers low post-process residues and passes IPC 184.108.40.206 SIR in an air-dried state. NC277 has proven to reduce preventative maintenance requirements for spray fluxing applications. Additionally, NC277 offers low-fuming and fast solvent evaporation. NC277 is designed to be no-clean, non-visible residue flux, which can be cleaned if critical to the product application.
“NC277 Liquid Flux is a VOC-free flux that is as electrically safe as an alcohol-based flux and has a medium residue that is suitable for long thermal demands,” stated Karl Seelig, V.P. of Technology.
Additionally, the company will highlight its tin-lead and lead-free alloys, including SN100C. SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium.
To discover all of AIM’s products, including lead-free and halogen free solder, visit the company in booth #1302 at the IPC APEX Expo or visit www.aimsolder.com.
Headquartered in Montreal, Canada, with locations worldwide, AIM is a leading global manufacturer of assembly materials for the electronics industry. The company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms, and specialty alloys such as indium and gold for electronics assembly, PC fabrication, component manufacturing, and other industries. For more information on how we can assist you visit www.aimsolder.com.