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New, Improved Technical Specification for the Nordson DAGE XD7800 Ruby XL X-ray Inspection System Specifically designed for Large-Area Printed Circuit Boards

Dec 10, 2012

 Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces the new, upgraded technical specification for its class-leading X-ray inspection system that is dedicated to large-area PCBs.

In keeping with the rest of Nordson DAGE’s jewel range of X-ray inspection systems, the system — now known as the XD7800 Ruby XL — is focused on and optimized for completely satisfying the needs of the electronics industry. Able to take a maximum board size of 1205 x 672 mm (47 x 26.4"), the XD7800 Ruby XL also includes the unique, maintenance-free, Nordson DAGE NT500 160kV sealed-transmissive X-ray tube that provides up to 10W of target power at sub-micron feature recognition and the exclusive Nordson DAGE 2 Mpixel iDAT3 digital image intensifier detector with real-time image enhancements. Combined, the features of the XD7800 Ruby XL system allow it to cover all of the failure analysis and production inspection tasks that are required for large circuit board assemblies.

In addition to this new, improved specification, the XD7800 Ruby XL for the first time can utilize Nordson DAGE’s award winning X-Plane™ analysis system option that allows X-ray inspection in any plane within the assembly, or its components, without the need to destroy these large, usually very expensive assemblies, as would be necessary with traditional CT analysis.

Dr. David Bernard, Nordson DAGE Product Manager – X-ray systems, said, “This system configuration and specification is what the market has been asking for. Using a digital image intensifier detector with the sealed-transmissive X-ray tube in the Ruby XL means it has enough target power to image through the thickest backplane boards while still retaining sufficient resolution to detail the smallest features. Now when you add our X-Plane™ capability to this, which permits easy separation of features at different layers in the assembly to improve clarity of analysis and all without the need to cut the board, it definitely is the optimum solution.”

For more information, visit www.nordsondage.com.


Nordson DAGE
Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries.  For more information, visit www.nordsondage.com.


Nordson Corporation delivers precision technology solutions that help customers increase speed, productivity and up-time, enable new products and features, and decrease material usage. The company engineers, manufactures and markets differentiated products and systems used for dispensing adhesives, coatings, sealants, biomaterials and other materials, fluid management, testing and inspection, and UV curing and surface plasma treatment, all supported by application expertise and direct global sales and service.  Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, building and construction, and general product assembly and finishing.  Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries.  Visit Nordson at www.nordson.com, twitter.com/Nordson_Corp, or Facebook.com/Nordson.


 

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