SMT, PCB Electronics Industry News

Universal Instruments’ APL Holds AREA Consortium Meeting

Nov 29, 2012

In October, Universal Instruments Corporation’s Advanced Process Lab (APL) held its third Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2012 at Binghamton University’s Innovative Technologies Complex in Vestal, N.Y. The 25-member consortium, organized by Universal, helps member organizations identify and develop new and emerging technologies, generating applicable knowledge for specific product development and manufacturing processes.

The two-day meeting covered a variety of topics relating to electronics assembly processes, reliability, and materials, as well as served as the consortium’s 2013 planning meeting. More than 60 attendees participated, coming from leading companies throughout the electronics industry, including Alcatel-Lucent, Analogic, Benchmark, Celestica, Curtiss-Wright, DEK USA, Ericsson, Harris, IBM, Indium, Koh Young, Laser Job Inc., Lockheed Martin, Motorola Solutions, Nihon-Superior, Plexus, Qualcomm, Rockwell Automation, and Rockwell Collins.

The agenda featured a series of presentations from researchers funded by the consortium, and one from consortium member Alcatel-Lucent. Research topics were presented by APL experts and funded professors from Binghamton University. Reliability was the key focus on day one, with sessions covering topics such as PCB pad cratering, conformal coat, BGA interposer and vibration testing. Also presented were various aspects of lead-free solder alloys, including their microstructure and fatigue behaviors, as well as an update on an ongoing PCB creep corrosion project. The agenda on day two continued with a presentation on thin-die wafer-level CSP process and reliability issues, a comparison between LGA and BGA reliability, and a look at the mechanical behavior of high-temperature solder alloys. Attendees then broke into groups to plan for the upcoming year before touring the laboratory facilities at Binghamton University.

We were delighted to share and discuss the results of all our tests with so many respected technical leaders from across the industry,” said Martin Anselm, PhD, manager of the AREA Consortium. “This provides a truly unique forum to better understand these assembly challenges.

The consortium continues to address lead-free solder attachment reliability for a wide range of components,” noted Richard Coyle of consortium member Alcatel-Lucent. “Their testing is uniquely comprehensive in that it extends beyond typical failure analysis and establishes the relationship between the solder microstructure and the failure mechanism. This topic is of particular interest to us and the results of these studies have been extremely valuable in helping us to assess our processes and reliability.”

To learn more about the AREA Consortium, including how to become a member, please contact AREA Consortium Manager Martin Anselm at 607-779-5077 or To find out how Universal’s Advanced Process Laboratory can help your organization, contact APL Director David Vicari at 607-779-5151 or


Feb 06, 2018 -

Universal Showcases Surface Mount and Odd-Form Capabilities at IPC APEX

Jul 06, 2017 -

Universal Welcomes SMTo Engineering to Channel Partner Network

Mar 08, 2017 -

Wistron and Universal Instruments Building Successful Alliance

Jul 21, 2016 -

Universal Appoints Jeff Knight General Manager,  APL and Advanced Technology Assembly Services

Feb 18, 2016 -

EEI Manufacturing Services Selects Universal Instruments' Fuzion Platform Versatile solution meets critical flexible production requirements for multi-million dollar contract.

Nov 14, 2015 -

Universal's APL to Deliver Technical Session at LED A.R.T. Symposium

Nov 01, 2015 -

Universal Features Surface Mount and Automation Solutions at Productronica 2015

May 07, 2015 -

Universal Fortifies Americas Operations, Appoints Michael Welch Regional Manager

Apr 01, 2015 -

Universal Appoints New Channel Partner in Brazil

Mar 16, 2015 -

Universal's Custom Tooling Paying Dividends for SEL

47 more news from Universal Instruments Corporation »

Apr 19, 2018 -

ULT LLC cooperates with GulfTech

Apr 18, 2018 -

MicroCare Presents its Latest Advancements in Cleaning at SMT Hybrid Packaging

Apr 18, 2018 -

SMTA Europe's Harsh Environments Conference Session 6 to Focus on Automotive Electronics

Apr 18, 2018 -

IPC Hand Soldering Competition Winner Crowned at Global Industrie/Midest 2018 in Paris

Apr 18, 2018 -

Koh Young Presenting on 3D Technologies at SMTA Rocky Mountain Chapter Technical Session

Apr 17, 2018 -

International Conference for Electronics Enabling Technologies (ICEET) Program Finalized

Apr 17, 2018 -

Seika Announces Plans for Optimized Drying Units to be Incorporated into all McDry Cabinets

Apr 17, 2018 -

Libra Industries Sponsors SMTA Ohio Valley Membership Appreciation Golf Outing

Apr 17, 2018 -

Preview for AdoptSMT for SMT 2018, Stand A4-458 We keep your production running -

Apr 17, 2018 -

cost saving SMT laser cut stencil

See electronics manufacturing industry news »

Universal Instruments’ APL Holds AREA Consortium Meeting news release has been viewed 1197 times

SMT Custom Nozzles

2-Part Mixing Pump