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Engineered Conductive Materials to Discuss New ECA Technology at the 8th CSPV Workshop in Shanghai

Nov 27, 2012

 Mark Francis,

 Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, announces that Mark Francis, global sales and marketing manager, will present “Conductive Adhesives for Back Contact Solar Modules” during the upcoming China Solar Grade Silicon and PV Power Conference (CSPV), scheduled to take place December 6-8, 2012 at the Shanghai Nan Jiao Hotel in Shanghai, China.

Electrically-conductive adhesives (ECAs) are used to make the interconnection between solar cells and back contact sheets in back contact solar modules. These materials must be extremely flexible to absorb stresses during thermal cycling, make stable interconnections to OSP treated copper contacts, cure during the lamination of the encapsulant and not gel before pressure is applied during lamination. Also, with increasing silver prices, the cost of  ECAs needs to be reduced. Cost reduction of ECAs is essential to ensuring that this emerging solar technology is cost competitive. This presentation will discuss how new ECA technology from ECM provides a lower cost solution without compromising performance. 

Mark joined ECM in 2010 as the Global Business Manager, Solar. Since then, he has become the Sales and Marketing Manager for solar and electronic materials. Mark has more than 25 years of experience working with conductive adhesives in R&D, QA management, sales and marketing. He graduated with a BS degree in Chemical Engineering from The University of Massachusetts, Lowell in 1982.


Engineered Conductive Materials (ECM) is a product line of Engineered Materials Systems, Inc. (EMS). ECM’s technology focus is electronic circuit fabrication and solar cell interconnection that compliments EMS’s circuit assembly product line. The company creates continual improvements that will guide its customers into the future. For more information, visit www.conductives.com.

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