SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Next April’s NEPCON China 2013 in Shanghai to Cover Electronics Manufacturing Industry Hotspots

Next April’s NEPCON China 2013 in Shanghai to Cover Electronics Manufacturing Industry Hotspots

Nov 16, 2012

The 23rd edition of NEPCON China will take place at the Shanghai World Expo Convention & Exhibition Center between April 23 and April 25, 2013.  A vivid exposition of current industry hotspots and future trends, NEPCON China 2013, will showcase traditional electronics manufacturing equipment and materials.  It will also feature a brand new Electronics Manufacturing Automation Pavilion, in response to exhibitor and visitor demand. 

As Asia’s largest SMT and electronics manufacturing technology event, NEPCON China has long reflected the health of the country’s electronics production equipment and electronics manufacturing industry.  Over three days, NEPCON China 2013 will present a comprehensive range of new technologies, products and solutions for the electronics manufacturing and SMT industries.  The displays will include SMT technology and equipment, electronics manufacturing and automation equipment, ESD and clean room devices, soldering equipment and materials, test and measurement machines, bar code equipment and materials, electronics manufacturing services and more.

NEPCON China 2013 will span a massive 38,000 sqm and host over 500 exhibitors from 22 countries and regions.  On show will be more than 1,000 electronics production systems, test and measurement products, components, and more. Over 20,000 leading industry practitioners and buyers from various fields are expected to attend.  Fuji, Hitachi, Juki, Samsung Techwin, Xunke, Nordson, BTU International, Indium, Agilent, Dage Electronics, Mirtec, TRI and other top suppliers of SMT, soldering and test/measurement equipment and materials, are already confirmed exhibitors at the event.

China’s electronics manufacturing industry continues to develop in leaps and bounds and the country has become the world’s undisputed electronics manufacturing hub.  Greater attention to production costs and efficiency by manufacturers is driving the industry to keep pace with automation trends. 

The Electronics Manufacturing Automation Zone at NEPCON China 2013 will feature application solutions for advanced industrial automation technologies and products.  It will include robot and motion control equipment, automation equipment and accessories, conveyors, tools, assembly equipment and materials, quality control and laser gears. 

NEPCON China 2013 is China’s only trade and purchasing platform focused on automation solutions for electronics manufacturers and electronics manufacturing equipment suppliers.  
To meet demand for high performance, multifunctional, portable and intelligent electronics in the Internet age, electronics components are trending towards miniaturization, or even microminiaturization.  To achieve higher-level packaging integration, advanced electronics packaging technologies have great potential for development.  Their advantages will drive the semiconductor industry into the post-Moore’s Law era.

Meanwhile, China, the country with the most centralized LED industry, has a changing packaging structure as the LED application market matures.  High luminous efficiency, high reliability, heat-sinking capabilities and ultra slim models are four prevailing trends for LED products.  Therefore, SMD, high-power packaging, integrated packaging and COB integrated packaging will become the focus of future demand. 

On this basis, NEPCON China 2013 will introduce the Advanced Electronics Packaging Zone, a showcase of the latest cutting-edge manufacturing technologies and processes in the industry.  These will include semiconductors, LED, supply units such as advanced packaging technologies, assembly devices, testing equipment, packaging materials and more. ESD and Clean Room Zones will be other features of the show.

With a keen focus on the electronics manufacturing industry’s emerging demands and trends, NEPCON China 2013 will allow materials suppliers, equipment manufacturers and service providers to collectively showcase their newest products, technologies and services. It will also serve as an all-in-one purchasing platform for manufacturers who want to extend and update their offerings. The show promises to be informational and commercially advantageous by also highlighting up-to-date market information. 
For more details on NEPCON China 2013, visit

Reed Exhibitions is the world’s leading events organizer, with more than 460 events in 36 countries.  In 2010, Reed brought together over 7 million event participants from around the world, generating billions of dollars in business.  Today Reed events, organized by 34 fully staffed offices, are held throughout the Americas, Europe, the Middle East and Asia-Pacific.

Reed Exhibitions holds over 460 events including exhibitions, seminars, forums and conferences, serving 44 industries.
Reed Exhibitions is part of Reed Elsevier Group plc, a FTSE 100 company and a publisher and information provider.  In 2009, Reed Elsevier made an adjusted pre-tax profit of £1.28 billion on turnover of £6.07 billion.
For more information please contact:





Aug 11, 2015 -

As PCB Industry Thrives, Industry Leaders to Join CS Show 2015

Aug 11, 2015 -

NEPCON: Unique Chinese Business Platform for Electronics Manufacturing Services (EMS) and EMS Sourcing Center to Light Up Shenzhen this August

Aug 06, 2015 -

The Rise of Electronics Manufacturing Automation: Promoting Intelligent Manufacturing and the “Smart Factory” Concept

Jul 15, 2015 -

China Embraces Smart Manufacturing as Electronics Manufacturing Industry Welcomes New Era

Jul 13, 2015 -

Leading Exhibitors Gather at CS Show 2015 PCB Industry Set To Benefit from Reform Dividends

Jul 09, 2015 -

Innovative Technologies Drive PCB Industry Growth: Shenzhen CS Show to Kick Off in August Set to Be Major PCB/FPC Procurement Event

Jul 08, 2015 -

After 30 Years NEPCON China Remains on Top

Jun 08, 2015 -

NEPCON SOUTH CHINA 2015 Set for Shenzhen this August

Jun 01, 2015 -

NEPCON China 2015 a Resounding Success in Shanghai

Apr 13, 2015 -

Letter of Congratulations from Tianjin SMT Committee

127 more news from Reed Exhibitions »

Sep 24, 2017 -

Europlacer Shows Printer at Productronica India – Just!

Sep 24, 2017 -

Microtronic GmbH Appoints Distributor for the LBT210 & ConTTest Systems in Spain and Portugal

Sep 24, 2017 -

INTERFLUX® Electronics Completes Testing on New Alloy at Ersa Demo Room

Sep 24, 2017 -

CyberOptics Launches Coordinate Measurement Software Suite for New High Speed SQ3000™ CMM System

Sep 21, 2017 -

Logic PD Sponsoring, Exhibiting at American Medical Device 2017

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -


Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

See electronics manufacturing industry news »

Next April’s NEPCON China 2013 in Shanghai to Cover Electronics Manufacturing Industry Hotspots news release has been viewed 985 times

  • SMTnet
  • »
  • Industry News
  • »
  • Next April’s NEPCON China 2013 in Shanghai to Cover Electronics Manufacturing Industry Hotspots
 Reflow System

BGA Rework Services