SMTA Announces Call for Papers for 2013 Events

Nov 11, 2012

SMTA announced that abstracts are now being accepted for several events taking place in 2013.  All submissions must be non-commercial in nature and focus on technology research rather than a company product. Submission of an abstract for an SMTA program is with the understanding that, if accepted, the author will provide a conference presentation and/or a technical paper for the proceedings.  The following events are all currently soliciting abstracts:

South East Asia Technical Training Conference on Electronics Assembly Technologies 2013 - Abstract Deadline: December 7th, 2012

International Conference on Soldering and Reliability (ICSR) - Abstract Deadline: January 18, 2013

SMTA International Conference - Abstract Deadline: February 28, 2013

International Wafer-Level Packaging Conference (IWLPC) - Abstract Deadline: March 15, 2013

On-line Presentations (Webinars & Webtorials) - Now Scheduling for 2013 - Contact Patti, patti@smta.org

Journal of SMT - Now Accepting for next quarter's publication - Contact Ryan, ryan@smta.org

All submissions must be non-commercial in nature and focus on technology research rather than a company product. Submission of an abstract for an SMTA program is with the understanding that, if accepted, the author will provide a conference presentation and/or a technical paper for the proceedings.

View details online.»

Please contact Patti Hvidhyld, patti@smta.org or 952-920-7682, with questions.


The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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