SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Association Connecting Electronics Industries (IPC)

IPC and SMTA Announce the Agenda for Session 3 of the High-Reliability Cleaning and Coating Conference

Oct 22, 2012

 Industry-leading associations IPC and SMTA jointly announce the agenda for Session 3 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.  The conference is intensely focused on electronics assembly reliability, and the influence of cleaning and coating upon producing reliable hardware.

Cleanliness Assessment and Process Control are becoming bigger issues as assemblies are built with bottom termination components within high dense platforms. Highly dense interconnects drive more performance in smaller platforms. Assembly residues may increase the risk of premature failure or improper functionality. The challenge for OEMs is to quantify safe residue levels and gain insight into how residues impact long-term reliability and functionality of hardware. To compound this problem, the question of “how clean is clean enough” is more challenging as conductors and circuit traces are increasingly narrower. 

The third session at the cleaning and coating conference addresses cleanliness assessment and process control. Doug Pauls of Rockwell Collins will chair this session. The speakers and topics are as follows:

1. A ROSE is Still a ROSE: Ionically, It Makes a Difference – Graham Naisbitt, GEN3Systems 

2. Localized Extraction Methods for Ionic Analysis – Eric Camden, Foresite, and Doug Pauls, Rockwell Collins

3. Cleaning Challenges in an HDI World – Mark Northrup, I.E.C. Electronics, Joe Russeau, Precision Analytical Lab, and Mike Bixenman, Kyzen

4. IPC-B-52 SIR: A Discussion of the Current Test Vehicle Design and Possible Modifications for the Future – Matt Kelly, IBM Corporation

5. A comparison of Extract Solution Composition for Bare Boards – Jennifer Klavon, Rockwell Collins

To advance your understanding of chemical and electrical effects on reliability of circuit assemblies and high dense interconnects, plan to attend the Cleaning and Conformal Coating Conference.

For more information about the conference, visit The technical program for the conference is available at

You must be a registered user to talk back to us.

More News from Association Connecting Electronics Industries (IPC)

Feb 23, 2017 -

IPC Honors Uyemura International Corp. and Honeywell with Corporate Recognition Awards

Feb 16, 2017 -

Long-time IPC Volunteer, Doug Pauls Inducted into IPC Hall of Fame

Feb 16, 2017 -

IPC Elects New Board Member

Feb 07, 2017 -

Best Technical Paper at IPC APEX EXPO 2017 Selected

Feb 06, 2017 -

Pana-Pacific Earns IPC/WHMA-A-620 Qualified Manufacturers Listing

Feb 03, 2017 -

IPC Invites Member-Company Executives to Help Build “Pulse-of-the-Industry” Data Service

Feb 02, 2017 -

North American PCB Sales Enjoyed Solid Growth in December

Jan 29, 2017 -

IPC President and CEO John Mitchell to Serve on the NAM’s Council of Manufacturing Associations Board of Directors

Jan 21, 2017 -

IPC North American EMS and PCB Statistical Programs Open

Jan 17, 2017 -

Colonial Assembly and Design, LLC Earns IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing

(803) more news from Association Connecting Electronics Industries (IPC)

IPC and SMTA Announce the Agenda for Session 3 of the High-Reliability Cleaning and Coating Conference news release has been viewed 490 times

PCB Cleaning

PCB machines