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Viscom SPI-AOI Uplink Named Best Product – Europe

Oct 22, 2012

 Viscom announces that it was awarded a 2012 Global Technology Award in the category of Best Product – Europe for its SPI-AOI Uplink Feature. The award was presented to the company during a Tuesday, October 16, 2012 ceremony that took place at the Walt Disney World Dolphin Hotel in Orlando, FL during SMTA International 2012. The SPI-AOI-Uplink function links paste inspection and post-reflow inspection results for both easy and effective process control as well as improved classification of AOI results.

The 3-D solder paste inspection is deployed in order to detect defects in paste print. Electronic assemblies that do not meet the specified criteria are already sorted out after the solder paste is printed. This is why the 3-D SPI has established itself as the standard by saving the unnecessary costs of reworking electronic assemblies, particularly in high-quality electronic products.

The Viscom S3088 SPI performs these tasks reliably and at the highest speed. All essential 3-D features such as volume, height and form are recorded and checked, as well as surface area, displacement and smearing.

Why Process Uplink now? In solder paste inspection, generally a deviation of up to ±50 percent of the target value is allowed to avoid a high alarm rate while still producing acceptable solder joints. The typical irregularities inherent in the paste print process prohibit tighter tolerance thresholds. Because the SPI system provides far more accurate measurement data about the solder paste, using the data to improve process quality and to fully exploit the performance capacity of 3-D solder paste inspection is only logical. The catchphrase for this: Viscom Process Uplink. Data from the SPI and the post-reflow AOI are linked and transferred to the verification station after the AOI. This feature reduces human error, improves error detection with significantly fewer false alarms and provides efficient tools to optimize the process.

Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

 

 

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