SMT, PCB Electronics Industry News

Package On Package Guide by Bob Willis FREE

Oct 12, 2012

Bob is just going to PoP

Bob is just going to PoP

This book is the second publication written by Bob Willis as a FREE download, his first on Pin In Hole Reflow has been read by over 3000 engineers worldwide and published with SMT magazine.

Package On Package Assembly Inspection & Quality Control will be launched in February 2013 with pre-registration for this publication available now at www.packageonpackagebook.com

In the meantime take a look at all of our PoP Training Products & Services at www.packageonpackage.co.uk

100+ pages, 12 sections, diagrams, colour images and x-rays

Topics will include:

Component packaging
Printed Circuit Board Design & Specification
Printing & AOI
Placement & dipping modules
Dip paste and flux
Convection and vapour phase profiling
Cleaning options
Optical and X-ray inspection
Underfill
Rework & reballing packages
Reliability
POP Process Assembly Defects
PoP Bibliography

Sep 03, 2017 -

Guide to QFN/LGA & BTC Process Defects Guide & FREE webinar from Bob Willis

Jul 28, 2017 -

PowerPoint presentations on Conventional & SMT Assembly to Download at Bobwillis.co.uk

May 21, 2017 -

Cleaning & Contamination Defects Photo CD-ROM

Apr 13, 2017 -

Plan your engineering process improvement with a monthly online webinar

Mar 22, 2017 -

Surface Mount Assembly & Defect Photo CD

Mar 08, 2017 -

Lead Free & Tin/Lead Wave Soldering Defect Guide to Download

Mar 06, 2017 -

0201, 01005 & Smaller Soldering, Assembly & Defect Photo CD

Mar 06, 2017 -

Archive Webinar Recordings on Soldering, PCB Assembly & Inspection

Mar 06, 2017 -

Hands on Master Class Series from Bob Willis

Feb 20, 2017 -

SMT and Conventional Photo CD ROM

69 more news from ASKbobwillis.com »

Sep 21, 2017 -

Logic PD Sponsoring, Exhibiting at American Medical Device 2017

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -

COT Announces PB Swiss Tools’ Two New INSIDER Models: INSIDER STUBBY and INSIDER STUBBY RATCHET

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

See electronics manufacturing industry news »

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