SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from ASKbobwillis.com


Package On Package Guide by Bob Willis FREE

Oct 12, 2012

Bob is just going to PoP

Bob is just going to PoP

This book is the second publication written by Bob Willis as a FREE download, his first on Pin In Hole Reflow has been read by over 3000 engineers worldwide and published with SMT magazine.

Package On Package Assembly Inspection & Quality Control will be launched in February 2013 with pre-registration for this publication available now at www.packageonpackagebook.com

In the meantime take a look at all of our PoP Training Products & Services at www.packageonpackage.co.uk

100+ pages, 12 sections, diagrams, colour images and x-rays

Topics will include:

Component packaging
Printed Circuit Board Design & Specification
Printing & AOI
Placement & dipping modules
Dip paste and flux
Convection and vapour phase profiling
Cleaning options
Optical and X-ray inspection
Underfill
Rework & reballing packages
Reliability
POP Process Assembly Defects
PoP Bibliography

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More News from ASKbobwillis.com

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Pin In Hole, Pin in Paste or Selective Reflow CD from Bob Willis

Jan 09, 2017 -

Solder Paste & Stencil Printing Defect Examples Available Royalty FREE

Jan 05, 2017 -

More BGA Defect Examples Available Royalty FREE

Dec 29, 2016 -

QFN LGA Photos for your Training Courses

Dec 29, 2016 -

Conformal Coating Defect Images for Presentations

Dec 12, 2016 -

NPL 2017 Free Webinars are Launched and Chaired by Bob Willis

Nov 10, 2016 -

NPL Future of Interconnection Reliability - The Way Forward

Nov 04, 2016 -

Robotic Iron & Laser Soldering for Lead-Free & High Temperature Alloys webinar

Oct 21, 2016 -

Online Soldering Webinars for All

Sep 06, 2016 -

New NPL Method for Testing Reliability of Electronics in Condensing Environment FREE Webinar

(54) more news from ASKbobwillis.com

Package On Package Guide by Bob Willis FREE news release has been viewed 817 times

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