SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

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Package On Package Guide by Bob Willis FREE

Oct 12, 2012

Bob is just going to PoP

Bob is just going to PoP

This book is the second publication written by Bob Willis as a FREE download, his first on Pin In Hole Reflow has been read by over 3000 engineers worldwide and published with SMT magazine.

Package On Package Assembly Inspection & Quality Control will be launched in February 2013 with pre-registration for this publication available now at

In the meantime take a look at all of our PoP Training Products & Services at

100+ pages, 12 sections, diagrams, colour images and x-rays

Topics will include:

Component packaging
Printed Circuit Board Design & Specification
Printing & AOI
Placement & dipping modules
Dip paste and flux
Convection and vapour phase profiling
Cleaning options
Optical and X-ray inspection
Rework & reballing packages
POP Process Assembly Defects
PoP Bibliography

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