SMT, PCB Electronics Industry News

Package On Package Guide by Bob Willis FREE

Oct 12, 2012

Bob is just going to PoP

Bob is just going to PoP

This book is the second publication written by Bob Willis as a FREE download, his first on Pin In Hole Reflow has been read by over 3000 engineers worldwide and published with SMT magazine.

Package On Package Assembly Inspection & Quality Control will be launched in February 2013 with pre-registration for this publication available now at www.packageonpackagebook.com

In the meantime take a look at all of our PoP Training Products & Services at www.packageonpackage.co.uk

100+ pages, 12 sections, diagrams, colour images and x-rays

Topics will include:

Component packaging
Printed Circuit Board Design & Specification
Printing & AOI
Placement & dipping modules
Dip paste and flux
Convection and vapour phase profiling
Cleaning options
Optical and X-ray inspection
Underfill
Rework & reballing packages
Reliability
POP Process Assembly Defects
PoP Bibliography

May 21, 2017 -

Cleaning & Contamination Defects Photo CD-ROM

Apr 13, 2017 -

Plan your engineering process improvement with a monthly online webinar

Mar 22, 2017 -

Surface Mount Assembly & Defect Photo CD

Mar 08, 2017 -

Lead Free & Tin/Lead Wave Soldering Defect Guide to Download

Mar 06, 2017 -

0201, 01005 & Smaller Soldering, Assembly & Defect Photo CD

Mar 06, 2017 -

Archive Webinar Recordings on Soldering, PCB Assembly & Inspection

Mar 06, 2017 -

Hands on Master Class Series from Bob Willis

Feb 20, 2017 -

SMT and Conventional Photo CD ROM

Feb 11, 2017 -

Join Assembly Soldering Inspection Defects LinkedIn Group

Feb 05, 2017 -

Solder Ball Elimination – In Wave, Selective & Reflow Webinar

67 more news from ASKbobwillis.com »

Jul 23, 2017 -

PDR Americas Partners with Orr Marketing, Inc. in the Carolinas

Jul 23, 2017 -

Zuken Announces XJTAG DFT Assistant for CR-8000 PCB design suite

Jul 23, 2017 -

SMTA Welcomes New Board Members

Jul 23, 2017 -

SMTA International Technical Program Expands, Includes Research from HDPUG and AREA Consortium

Jul 23, 2017 -

Senator Ron Johnson Discusses U.S. Policy Priorities in Townhall Discussion with IPC-member Company, VirTex MTI

Jul 21, 2017 -

Epec Now Offering PCB Layout and Design Services

Jul 21, 2017 -

Help customer solve problems of 750L machine

Jul 19, 2017 -

Digicom Electronics Receives AS9100:2016 (RevD) Aerospace and ISO 9001:2015 Certifications

Jul 19, 2017 -

Conecsus Presents SMT Metals Waste Recycling Solutions at SMTAI 2017

Jul 19, 2017 -

New Metcal HTD Tips & Hand-piece Increase Throughput and Save Money

See electronics manufacturing industry news »

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