SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Sep 26, 2012

Mini-Oven Reball/PreBump Unit

Mini-Oven Reball/PreBump Unit

MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system at the upcoming Mississauga EPTECH Electronics Show, scheduled to take place September 27, 2012 at the Mississauga Convention Centre in Canada.

MARTIN’s Mini-Oven 04 Reball/Prebump unit is ideal for the complete QFN solder bumping process, even for the smallest pitches. Using a unique Hotprint Technology, the mask is not removed after printing paste, but remains on the QFN during reflow.

The reballing function is capable of handling a diverse range of BGAs, as well as QFNs and CSPs. Processes can be completed in as little as three minutes. The simple Rapid Technology soldering profiles rigorously apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates and maintain a safe temperature zone.  

The unit offers programmable modes and a nitrogen process gas supply. Up to 99 profiles can be accommodated, with the ability to edit individual profiles and fine tune parameters.

For further information, visit MARTIN at the Mississauga EPTECH Electronics Show or online at www.bgarework.com.


MARTIN has developed affordable rework, BGA reballing and dispensing technologies for 30 years with a strong commitment to high quality, precision and reliability. The USA sales and service office is located in Manchester, NH. The company‘s manufacturing facility is in Wessling, Germany. MARTIN is a FINETECH company. 

 

 

Apr 07, 2016 -

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Nov 27, 2013 -

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 08, 2013 -

Finetech Unveils High Force ACF Bonder

May 28, 2013 -

Al Cabral Joins Finetech as Regional Sales Manager

Mar 11, 2013 -

Donated Finetech Die Bonder Installed at Pennsylvania State University

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 10, 2012 -

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

Sep 05, 2012 -

High-Accuracy R&D Die Bonder on Display at Finetech Booth #505 at IMAPS 2012 – San Diego

76 more news from Finetech »

Oct 23, 2017 -

W.J. Murphy Associates Receives Outstanding Achievement Award from Juki

Oct 23, 2017 -

Libra Industries Upgrades to the Latest Technology in Post Reflow AOI

Oct 23, 2017 -

Data I/O Announces SentriX™ Secure Provisioning Support for Maxim’s DeepCover® Secure Authentication ICs

Oct 23, 2017 -

Transition Automation Intros Holder for Permalex Hand Squeegee

Oct 23, 2017 -

Manual Cleaning of Printed Board Assemblies – Step By Step Guide Coming Soon

Oct 23, 2017 -

New Online Webinars from the Desk of Bob Willis

Oct 22, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Oct 19, 2017 -

Juki Automation Systems Awards Quantum Systems ‘Representative of the Year –Best Performance’

Oct 19, 2017 -

Logic PD to Exhibit Medical Market Successes at MD&M Minneapolis 2017

Oct 18, 2017 -

Horizon Sales Earns Juki Sales Awards

See electronics manufacturing industry news »

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show news release has been viewed 1801 times

  • SMTnet
  • »
  • Industry News
  • »
  • MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show
SMT Prototype Stencils - BEST, Inc.

TWEEZER-VAC ELITE Vacuum SMD Tweezer Kit