SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from ZESTRON Americas


ZESTRON Presents “Cleaning Under Low Stand-off Components” at SMART Group Annual Conference & Exhibition 2012

Sep 17, 2012

 ZESTRON, the worldwide leader in high precision cleaning products, services and training solutions for the electronics manufacturing industry, is pleased to announce that Robert Murphy, ZESTRON Regional Sales Manager Europe, is scheduled to present the paper “Cleaning Under Low Stand-off Components” at the SMART Group Annual Conference & Exhibition taking place September 18th and 19th in Thame, Oxfordshire, UK. 

Contacts, commonly found under components such as BGAs, micro BGAs or CSPs, pose mechanical barriers and complicate the capillary penetration of the cleaning and rinsing agent.  ZESTRON has conducted a study to determine which type of mechanical agitation would result in the best overall cleaning performance and address this issue.  Mr. Murphy will present the results of the study on September 19th.

ZESTRON invites you to learn more about cleaning under low stand-off components and to have your cleaning questions answered by one of our cleaning experts.  To register for this event or to get additional information, please visit http://www.smartgroup.org/.


 ZESTRON:
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With five worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information or to tour one of our unparalleled technical centers, please visit http://www.zestron.com.

 

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