SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

Sep 10, 2012

MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year. The PoP Center will take place October 16 and 17 in the SMTA International exhibit hall in the Walt Disney World Dolphin Hotel in Orlando, FL.

MARTIN will highlight the EXPERT 10.6 Rework Station in the PoP Center. The system can remove all layers of a PoP at the same time, or remove layer by layer. And with precise temperature control, neighboring components remain undisturbed. The EXPERT 10.6 offers an affordable PoP rework solution with the best price/performance ratio.

PoP applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on design and assembly engineers. PoP also is finding favor in professional handheld tablets and commercial high-reliability applications. Package on package is new to many engineers but ready to explode in the marketplace. In simple terms, PoP represents the stacking of area arrays one on top of another, either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. PoP packaging systems may include flip chip, wire bonding or conductive adhesives for device to device interconnection.

For further information on the PoP Center, visit http://www.smta.org/smtai/pop.cfm.


MARTIN has developed affordable rework, BGA reballing,  hand soldering,  and dispensing technologies for nearly 30 years. The USA sales and service office is located in Manchester, NH. The company‘s manufacturing facility is in Wesseling, Germany. MARTIN is a FINETECH company.

Apr 07, 2016 -

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Nov 27, 2013 -

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 08, 2013 -

Finetech Unveils High Force ACF Bonder

May 28, 2013 -

Al Cabral Joins Finetech as Regional Sales Manager

Mar 11, 2013 -

Donated Finetech Die Bonder Installed at Pennsylvania State University

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Sep 05, 2012 -

High-Accuracy R&D Die Bonder on Display at Finetech Booth #505 at IMAPS 2012 – San Diego

76 more news from Finetech »

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

Aug 17, 2017 -

Libra Industries Announces Two 20-Year Service Awards in Q2 2017

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 -

What is SMT and where to by SMT spare parts

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

Aug 16, 2017 -

COT Increases Manufacturing Capability with New DMG Horizontal Milling Centers

See electronics manufacturing industry news »

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012 news release has been viewed 2794 times

  • SMTnet
  • »
  • Industry News
  • »
  • MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012
PCB machines

Selective Conformal Coating System - GPD SimpleCoat