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High-Accuracy R&D Die Bonder on Display at Finetech Booth #505 at IMAPS 2012 – San Diego

Sep 05, 2012

Finetech will showcase the FINEPLACER® Lambda in Booth #505 at the upcoming IMAPS 45th International Symposium on Microelectronics exhibition, scheduled for September 11-13, 2012 at the Town & Country Resort and Conference Center in San Diego, CA.

The FINEPLACER® Lambda is ideal for low-volume, prototyping and R&D environments requiring flexibility, precision, advanced technologies and the highest bonding placement accuracy (down to 0.5 micron). This versatile system can be used for precise placement, die-attach and advanced packaging using various bonding technologies — soldering (Eutectic, Au/Sn, Indium), thermo compression, thermo-/ultrasonic bonding, gold/tin laser bar bonding, adhesives and UV curing. Options are available for inert atmosphere and forming gas.

Applications include flip chip, 3-D packaging, MEMS, wafer-level packaging (C2W), optoelectronic and micro optics bonding and assembly, sensors, and more. 


Finetech is a leading manufacturer of innovative rework and advanced packaging and assembly equipment for the latest advanced packages. The modular design of the FINEPLACER® platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. Finetech is headquartered in Berlin, Germany, with offices in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China; and Penang, Malaysia.

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