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Pennsylvania State University Wins Finetech Die Bonder Donation

Aug 29, 2012

Pennsylvania State University was selected in a university donation drawing for a FINEPLACER® Pico MA bonder on August 15, 2012. The multi-application system with 5 micron placement accuracy is valued at $100,000. As part of its 20th anniversary celebration this year, Finetech chose to give back to the university R&D segment of its business by donating a bonder for research and education.  Nearly 400 entries were received, representing 95 universities.

International Microelectronics and Packaging Society (IMAPS) President Voya Markovich visited the Finetech office in New Hampshire to select the winning university in a random drawing. IMAPS also shares a close relationship with academic researchers through its Microelectronic Foundation. This group supports students and research with activities that promote an understanding of how components are made as well as related assembly technologies and materials.

We are delighted to be chosen for the die bonder donation and look forward to using it in our new lab for research dealing with heterogeneous integration of materials and MEMS packaging applications. I have always wanted a die bonder to complete my packaging lab, but funding was always the challenge,” states Srinivas Tadigadapa, Pennsylvania State University, Professor, College of Engineering - MEMS Nanoscale and Devices Group.

With a wide installed base of systems at many prestigious institutions, FINEPLACER® die bonders provide an ideal solution for advanced technology environments utilizing diverse applications. The FINEPLACER® Pico MA is an “all-in-one” platform for precise packaging and assembly applications -- such as flip chip, optoelectronics, 3D, wafer level integration, micro-optics assembly, sensor packaging and precise die bonding.

For more information about the university donation drawing and Finetech, visit http://www.finetechusa.com/bonders/products/promotion.html.

For more information about the MEMS Nanoscale and Devices Group http://mnd.ee.psu.edu/index.asp.


 Finetech is a leading manufacturer of equipment for manual and fully automatic component rework and high-precision bonding and die attach. The company services customers in a broad range of industries including aerospace, medical technology, consumer electronics, semiconductor, optoelectronics, military, universities and research.  Finetech offers a flexible approach to customer support and welcomes the opportunity to create customized, effective solutions.  Corporate headquarters and main production are in Berlin, Germany.  Sales and Technical support centers are located in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China and Kuala Lumpur, Malaysia.


Pennsylvania State University – MEMS Nanoscale and Devices Group.
The Pennsylvania State Electrical Engineering Department, established in 1893, is among the largest, oldest, and most innovative in the nation.  The main focus of the department’s Micro & Nanoscale Devices Group is to design, model, and fabricate devices using MEMS fabrication technologies for transducer applications and investigation of interfacial science at the nanoscale. Research areas include:  materials and devices for electronic, photonic, bioelectronic and MEMS applications, amorphous and crystalline silicon, III-V compounds, organic thin films, ferroelectric and piezo-electric; development of novel device structures and manufacturing methods, device and circuit simulation and modeling, device and material characterization


 

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