SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Martel Marketing Communications, Inc.


Smyczek Optimizes SMT Processes with Viscom 3D-SPI Process Uplink

Aug 23, 2012

From left to right: Michael Schlegel (CEO Smyczek GmbH & Co. KG), Roman Dyck (AOI-Operator Smyczek GmbH & Co. KG)

From left to right: Michael Schlegel (CEO Smyczek GmbH & Co. KG), Roman Dyck (AOI-Operator Smyczek GmbH & Co. KG)

 Smyczek GmbH & Co. KG, based in Verl, Germany, announces that it has optimized its SMT processes with the implementation of 3D paste inspection with Process Uplink by Viscom. The company is a member of the Beckhoff group and, as a mid-sized EMS services provider, a specialist for the assembly of PCBs as well as for the entire production and assembly process. With 11 SMD lines, all equipped with an AOI system for quality assurance, the capacity reaches 22 million components each week.

The Viscom S3088 solder paste inspection (SPI) system was initially installed to evaluate the Viscom Process Uplink. Given the obvious advantages in the process reliability, Smyczek quickly made the decision to purchase the system. As a result, the technology partnership of both companies is further deepened. Smyczek emphasizes the usefulness of Process Uplink for many individual aspects, such as printer setup and the optimization of the overall process.

With the new 3D SPI system we can now evaluate the printing result of the paste a lot more precisely,” explained Smyczek’s CEO Michael Schlegel. “Furthermore we can recognize the relation between the paste printing result and the real appearance of defects with the Process Uplink. We can see which defects in the paste printing will actually create a problem at the end. Through our frequent product change we can avoid unnecessary defects quite early in the production line and thus guarantee a best product series launch.”

You must be a registered user to talk back to us.

More News from Martel Marketing Communications, Inc.

Mar 07, 2013 -

Semikron Checks DCBs with Automatic Wirebond AOI from Viscom

Mar 07, 2013 -

Viscom Scores NPI Award for Its SPI-AOI Uplink Function

Feb 21, 2013 -

Viscom presents new XM camera module for extreme cycle times and highest inspection depth

Jan 17, 2013 -

Viscom to Debut S6056 XM AOI with New 65 Megapixel Camera Head at the IPC APEX EXPO

Oct 15, 2012 -

Viscom Semiautomatic X-ray Inspection Now Offers High-Performance Verification Linkage

Oct 11, 2012 -

Manufacture with Confidence – Combined Optical and X-ray Inspection from Viscom

Sep 14, 2012 -

Viscom AG Obtains “Authorized Economic Operator” Status

Sep 13, 2012 -

Viscom to Exhibit AOI/AXI Capabilities and New Process Uplink at SMTA International 2012

Aug 23, 2012 -

Smyczek Optimizes SMT Processes with Viscom 3D-SPI Process Uplink

Jul 26, 2012 -

Viscom Strengthens Its Manual and Semiautomatic Inspection for the Electronics Industry

(3) more news from Martel Marketing Communications, Inc.

Smyczek Optimizes SMT Processes with Viscom 3D-SPI Process Uplink news release has been viewed 3160 times

Solder Paste Inspection