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STI Electronics, Inc.’s Engineering Services Division to Exhibit at the 2012 SBIR Beyond Phase II Conference & Technology Showcase

Aug 14, 2012

 STI Electronics, Inc., a full service organization providing training services, electronic and industrial distribution, analytical and failure analysis, prototyping, and small- to medium-volume PCB assembly, will exhibit at the upcoming National SBIR Beyond Phase II Conference & Technology Showcase, scheduled to take place September 10-13, 2012 at the JW Marriott Indianapolis in Indiana.

STI’s Engineering Services division will feature its custom manufacturing for the defense sector, as well as counterfeit detection. Additionally, the microelectronics lab specializes in state-of-the-art engineering design and assembly including current technologies such as Chip-On-Board (COB) and Multichip Module (MCM) as well as emerging technologies such as STI’s patented packaging technology coined Imbedded Component/Die Technology (IC/DT®).

The Engineering Services division is a multifaceted technical organization that provides engineering support in the field of electronics manufacturing. From product design and manufacturability analysis to pre-production prototype and development, STI’s Prototype and Development Lab is a full service design review and pre-production facility.

For more information about STI’s engineering services, visit www.stielectronicsinc.com.


Since 1982, STI Electronics, Inc. (STI) has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly in the electronics industry. STI also produces a complete line of solder training kits and training support products. Additionally, the company distributes products for the electronics and industrial markets. For more information, visit www.stielectronicsinc.com.

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