SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Conductive Materials Launches Fast Curing High Tg Conductive Adhesive CA-100 for Ribbon Stringing CIGS Solar Modules

Engineered Conductive Materials Launches Fast Curing High Tg Conductive Adhesive CA-100 for Ribbon Stringing CIGS Solar Modules

Aug 10, 2012

 Engineered Conductive Materials, a leading global supplier of conductive interconnect materials for photovoltaic applications, introduces its new fast curing Conductive Adhesive CA-100 for stringing and bussing next-generation CIGS solar modules. This material formulation is optimized for excellent conductivity and stability on molybdenum and other substrates used in thin-film manufacturing.

CA-100 is designed for thermal cycling and damp heat stability on molybdenum and other substrates used in the CIGS manufacturing process. The high Tg of CA-100 is suitable for manufacturing semi-rigid glass backed modules and is not designed for flexible modules utilizing reel-to-reel manufacturing. The material can be partially cured for 60 to 90 seconds, providing enough “green strength” to withstand induced stresses from the manufacturing process until the adhesive cure is completed during the encapsulant lamination process. CA-100 has optimized rheology for dispensing, excellent damp heat resistance and conductivity stability on molybdenum, tin, tin-silver and silver-plated ribbons.

CA-100 is the latest addition to Engineered Conductive Material’s full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications, as well as conductive grid inks for photovoltaic applications.

For more information about the CA-100 Conductive Adhesive or to learn how Engineered Conductive Materials can define, develop and create an engineered material solution that is right for your company, visit www.conductives.com.


Engineered Conductive Materials (ECM).con is a product line of Engineered Materials Systems, Inc. (EMS). ECM’s technology focus is electronic circuit fabrication that compliments EMS’s circuit assembly product line. The company creates continual improvements that will guide its customers into the future. For more information, visit www.conductives.com.

Oct 22, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Oct 18, 2017 -

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

Sep 13, 2017 -

Engineered Material Systems to Showcase Liquid and Dry Film Negative Tone Photoresists at MicroTAS

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 10, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer Level Packaging

May 01, 2017 -

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at Intersolar Europe

Apr 22, 2017 -

New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging

Mar 22, 2017 -

Engineered Material Systems Introduces New UV Cured Adhesive for Bonding Lens Holders in Camera Modules

Mar 20, 2017 -

Engineered Material Systems, Inc. Develops Negative Photoresist for MEMS and IC Wafers

Mar 14, 2017 -

Engineered Material Systems to Showcase CA-150 Series Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

50 more news from Engineered Materials Systems, Inc. »

Oct 23, 2017 -

W.J. Murphy Associates Receives Outstanding Achievement Award from Juki

Oct 23, 2017 -

Libra Industries Upgrades to the Latest Technology in Post Reflow AOI

Oct 23, 2017 -

Data I/O Announces SentriX™ Secure Provisioning Support for Maxim’s DeepCover® Secure Authentication ICs

Oct 23, 2017 -

Transition Automation Intros Holder for Permalex Hand Squeegee

Oct 23, 2017 -

Manual Cleaning of Printed Board Assemblies – Step By Step Guide Coming Soon

Oct 23, 2017 -

New Online Webinars from the Desk of Bob Willis

Oct 19, 2017 -

Juki Automation Systems Awards Quantum Systems ‘Representative of the Year –Best Performance’

Oct 19, 2017 -

Logic PD to Exhibit Medical Market Successes at MD&M Minneapolis 2017

Oct 18, 2017 -

Horizon Sales Earns Juki Sales Awards

Oct 18, 2017 -

MarTec Receives Outstanding Achievement Award from Juki Automation Systems

See electronics manufacturing industry news »

Engineered Conductive Materials Launches Fast Curing High Tg Conductive Adhesive CA-100 for Ribbon Stringing CIGS Solar Modules news release has been viewed 1042 times

  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Conductive Materials Launches Fast Curing High Tg Conductive Adhesive CA-100 for Ribbon Stringing CIGS Solar Modules
PCB Assembly Equipment Auctions

SMT Equipment Online Auctions