SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Conductive Materials Launches Fast Curing High Tg Conductive Adhesive CA-100 for Ribbon Stringing CIGS Solar Modules

Engineered Conductive Materials Launches Fast Curing High Tg Conductive Adhesive CA-100 for Ribbon Stringing CIGS Solar Modules

Aug 10, 2012

 Engineered Conductive Materials, a leading global supplier of conductive interconnect materials for photovoltaic applications, introduces its new fast curing Conductive Adhesive CA-100 for stringing and bussing next-generation CIGS solar modules. This material formulation is optimized for excellent conductivity and stability on molybdenum and other substrates used in thin-film manufacturing.

CA-100 is designed for thermal cycling and damp heat stability on molybdenum and other substrates used in the CIGS manufacturing process. The high Tg of CA-100 is suitable for manufacturing semi-rigid glass backed modules and is not designed for flexible modules utilizing reel-to-reel manufacturing. The material can be partially cured for 60 to 90 seconds, providing enough “green strength” to withstand induced stresses from the manufacturing process until the adhesive cure is completed during the encapsulant lamination process. CA-100 has optimized rheology for dispensing, excellent damp heat resistance and conductivity stability on molybdenum, tin, tin-silver and silver-plated ribbons.

CA-100 is the latest addition to Engineered Conductive Material’s full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications, as well as conductive grid inks for photovoltaic applications.

For more information about the CA-100 Conductive Adhesive or to learn how Engineered Conductive Materials can define, develop and create an engineered material solution that is right for your company, visit www.conductives.com.


Engineered Conductive Materials (ECM).con is a product line of Engineered Materials Systems, Inc. (EMS). ECM’s technology focus is electronic circuit fabrication that compliments EMS’s circuit assembly product line. The company creates continual improvements that will guide its customers into the future. For more information, visit www.conductives.com.

Jun 11, 2018 -

Engineered Material Systems to Showcase Next Generation Electrically Conductive Adhesives at Intersolar Europe

May 08, 2018 -

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Mar 12, 2018 -

New Non-Conductive Die Attach Adhesive for Image Sensors & Circuit Assembly Applications

Mar 08, 2018 -

EMS Introduces Dry Film Negative Photoresist for Sealing Through-Silicon Vias in CMOS Wafers

Jan 28, 2018 -

Engineered Material Systems Introduces a New Two-Component Epoxy Encapsulant (506-03A/B)

Jan 28, 2018 -

Engineered Material Systems to Showcase Jet Dispense SMT at IPC APEX EXPO

Dec 05, 2017 -

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Dec 03, 2017 -

Engineered Material Systems Introduces a New Low-Temperature Cure Electrically Conductive Adhesive

Oct 22, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Oct 18, 2017 -

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

58 more news from Engineered Materials Systems, Inc. »

Jun 21, 2018 -

New Applicator Guns from Techcon at Farnborough International Airshow

Jun 21, 2018 -

IPC’s PCB Technology Trends Study Underway, PCB Fabricator Survey Open Until July 13

Jun 21, 2018 -

YXLON International to Host Three Open House Events at Its Lab One Facility

Jun 21, 2018 -

ROSIN RESINS FOR SOLDERING SOLUTION

Jun 20, 2018 -

ECO-FRIENDLY MEETS HIGH-TECH – Product Launch at Nepcon Thailand

Jun 20, 2018 -

KYZEN Sees Growth in Asia & Expands Marketing Support

Jun 20, 2018 -

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2019 Deadline for technical conference paper abstracts extended to: June 29, 2018

Jun 20, 2018 -

Inspection Services Labs in San Jose and Ohio Now Fully Equipped with Non-Destructive Testing Technology

Jun 20, 2018 -

VJ Electronix Promotes Frank Cosentino to Western Regional Sales Manager for the Americas

Jun 20, 2018 -

Scienscope Expands Partnership with Restronics

See electronics manufacturing industry news »

Engineered Conductive Materials Launches Fast Curing High Tg Conductive Adhesive CA-100 for Ribbon Stringing CIGS Solar Modules news release has been viewed 5 times

  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Conductive Materials Launches Fast Curing High Tg Conductive Adhesive CA-100 for Ribbon Stringing CIGS Solar Modules
used pcb assembly equipment - lel semi

pcb components vacuum pick up