SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Engineered Materials Systems, Inc.


Engineered Conductive Materials Launches Fast Curing High Tg Conductive Adhesive CA-100 for Ribbon Stringing CIGS Solar Modules

Aug 10, 2012

 Engineered Conductive Materials, a leading global supplier of conductive interconnect materials for photovoltaic applications, introduces its new fast curing Conductive Adhesive CA-100 for stringing and bussing next-generation CIGS solar modules. This material formulation is optimized for excellent conductivity and stability on molybdenum and other substrates used in thin-film manufacturing.

CA-100 is designed for thermal cycling and damp heat stability on molybdenum and other substrates used in the CIGS manufacturing process. The high Tg of CA-100 is suitable for manufacturing semi-rigid glass backed modules and is not designed for flexible modules utilizing reel-to-reel manufacturing. The material can be partially cured for 60 to 90 seconds, providing enough “green strength” to withstand induced stresses from the manufacturing process until the adhesive cure is completed during the encapsulant lamination process. CA-100 has optimized rheology for dispensing, excellent damp heat resistance and conductivity stability on molybdenum, tin, tin-silver and silver-plated ribbons.

CA-100 is the latest addition to Engineered Conductive Material’s full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications, as well as conductive grid inks for photovoltaic applications.

For more information about the CA-100 Conductive Adhesive or to learn how Engineered Conductive Materials can define, develop and create an engineered material solution that is right for your company, visit www.conductives.com.


Engineered Conductive Materials (ECM).con is a product line of Engineered Materials Systems, Inc. (EMS). ECM’s technology focus is electronic circuit fabrication that compliments EMS’s circuit assembly product line. The company creates continual improvements that will guide its customers into the future. For more information, visit www.conductives.com.

You must be a registered user to talk back to us.

More News from Engineered Materials Systems, Inc.

Nov 14, 2016 -

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Oct 04, 2016 -

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Smart Card Assembly Applications

Sep 13, 2016 -

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding

Sep 08, 2016 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Aug 08, 2016 -

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Dec 05, 2015 -

Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference

Aug 26, 2015 -

Engineered Materials Systems to Exhibit DF-3000 Series Negative Film Photoresists at SEMI MEMS 2015

Aug 23, 2015 -

Engineered Material Systems Introduces DF-3050 Dry Film Negative Photoresist

Jul 21, 2015 -

Engineered Materials Systems Introduces Low-Cost Snap Cure Conductive Adhesive for Stringing Solar Modules

Jun 17, 2015 -

Engineered Material Systems Introduces DF-3005 Dry Film Negative Photoresist

(40) more news from Engineered Materials Systems, Inc.

Engineered Conductive Materials Launches Fast Curing High Tg Conductive Adhesive CA-100 for Ribbon Stringing CIGS Solar Modules news release has been viewed 821 times

Boundary Scan

Reflow Ovens thermal process improvement