SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Association Connecting Electronics Industries (IPC)


IPC-HDBK-850 Sets Guidelines for Potting and Encapsulating Boards

Aug 09, 2012

 IPC – Association Connecting Electronics Industries® has released IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.

This new handbook covers a broad range of protective materials for printed boards, providing designers and users with an efficient tool to help select encapsulants for printed board assemblies.

IPC-HDBK-850 includes information on choosing, mixing, applying and dispensing for each of the materials listed. In addition, it explains the techniques that should be used when repairs are necessary.

"Nobody has addressed these materials before,” said Barry Ritchie of Dow Corning Corp., who chairs the IPC Potting and Encapsulation Task Group. “As circuit technology gets smaller, with technologies like fine pitch and chip on board, conductors are so close that any moisture can cause a failure. Reliability requirements are also changing for many types of products like portables and in high reliability fields like aircraft, military consumer and automotive technologies.”
Although product developers have used these protective materials for years without a specification or handbook, Ritchie said having a reference guide will help designers and manufacturing personnel save time because all the information they need is now located in one place.

The handbook is 68 pages long and features more than 50 illustrations to help users better understand the intricacies of the various materials.

IPC-HDBK-850 is available through the IPC online store at www.ipc.org/HDBK-850. IPC members may purchase a hard-copy of the standard for $50; the industry price is $100. For more information or to purchase IPC-HDBK-850, visit www.ipc.org/HDBK-850.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.

You must be a registered user to talk back to us.

More News from Association Connecting Electronics Industries (IPC)

Dec 06, 2016 -

IPC Study on North American PCB Industry Reports Growth in Military/Aerospace Market

Nov 30, 2016 -

North American PCB Book-to-Bill Ratio Climbs to 1.08

Nov 17, 2016 -

PCB Executive Forum Focuses on Critical Issues Senior-level executives to meet at IPC APEX EXPO

Nov 15, 2016 -

Turn Inspiration into Innovation through IPC APEX EXPO 2017 Educational Programs

Nov 09, 2016 -

IPC Releases New Online Training Course, IPC Essentials

Nov 09, 2016 -

IPC Issues Statement on the 2016 Election Results

Nov 07, 2016 -

ISC Engineering, LLC Earns Certification as Qualified Manufacturer to IPC/WHMA-A-620

Oct 20, 2016 -

Session 4 of IPC & SMTA's Conference to Focus on Ultra-Thin or Nanocoatings

Oct 20, 2016 -

World PCB Production in 2015 Estimated at $58.6 Billion IPC World PCB Production Report Released

Oct 20, 2016 -

Mayim Bialik Chosen as Opening Keynote at IPC APEX EXPO 2017 Industry votes to hear from actress and neuroscientist

(789) more news from Association Connecting Electronics Industries (IPC)

IPC-HDBK-850 Sets Guidelines for Potting and Encapsulating Boards news release has been viewed 718 times

Manufacturing Software

pcb components vacuum pick up