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  • Multitest at SEMICON Taiwan 2012: Leading Solutions for High Parallel Test of SoCs, MEMS and 3D Packages

Multitest at SEMICON Taiwan 2012: Leading Solutions for High Parallel Test of SoCs, MEMS and 3D Packages

Aug 02, 2012

Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, will exhibit in booth #1185 at the upcoming SEMICON Taiwan Expo, scheduled to take place September 5-7, 2012 at the TWTC Nangand Hall in Taipei, Taiwan.

Multitest is the leading supplier of high-parallel MEMS test and calibration equipment, packages with multiple sensors (up to nine DoF) and MEMS in heterogeneous 3D stacks. At SEMICON Taiwan, company representatives will showcase the InMEMS solution.

The setup allows high parallel MEMS test and calibration. It combines a standard strip handler – Multitest InStrip – and an InMEMS module for up to nine DoF test.

The InStrip can handle both strips and packages in carriers (www.multitest.com/InCarrier). The architecture of the InStrip ideally allows configuration for 3D in-process test of TSV partial stacks.

(www.multitest.com/InStrip3D).


Multitest (headquartered in Rosenheim, Germany) is one of the world’s leading manufacturers of test equipment for semiconductors. Multitest markets test handlers, contactors and ATE printed circuit boards. Multitest has more than 30 years of experience in the semiconductor industry, providing solutions to the automotive, consumer and communication but also to the sensor market. Globally, more than 900 employees serve the company’s customers in offices and branches in North America, Singapore, Malaysia, the Philippines, Taiwan, China and Thailand.
www.multitest.com

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