The Balver Zinn Group announces that Cobar Solder Products Inc. will sponsor and participate in the second annual IPC Midwest Soldering competition held in conjunction with the IPC Midwest Exhibition & Conference, scheduled to take place August 22-23, 2012 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL. The company will exhibit its lead-free SN100C-XF3+ solder paste and wire as well as high-performance fluxes and other related soldering materials in Booth #809.
Over two days, contestants will compete to build a functional electronics assembly within a half-hour time limit. Assemblies will be judged on soldering in accordance with IPC-A-610E Class 3 criteria, the speed at which assembly was produced and overall electrical functionality of assembly.
In conjunction with the soldering competition, Cobar Solder Products will exhibit its SN100C-XF3+ lead-free solder paste and wire, which accommodate extended reflow profiles with or without the use of nitrogen. With XF3+, wetting on all common pad finishings is excellent, yielding shiny joints reminiscent of leaded solders. Additionally, the paste exhibits a robust printing window.
SN100C- XF3+ offers better results for eliminating voiding when compared to any SAC-alloy. The paste provides improved print performance as well as long stencil life. XF3+ allows reflow without N2 and offers a high tack force/time.
Cobar Solder Products is the U.S. division of the Balver Zinn/Cobar Group.
For more information visit: www.cobar.com.