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Cobar Solder Products to Sponsor the Second Annual IPC Midwest Soldering Competition

Jul 26, 2012

SN100C- XF3+

SN100C- XF3+

 wire

The Balver Zinn Group announces that Cobar Solder Products Inc. will sponsor and participate in the second annual IPC Midwest Soldering competition held in conjunction with the IPC Midwest Exhibition & Conference, scheduled to take place August 22-23, 2012 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL. The company will exhibit its lead-free SN100C-XF3+ solder paste and wire as well as high-performance fluxes and other related soldering materials in Booth #809.

Over two days, contestants will compete to build a functional electronics assembly within a half-hour time limit. Assemblies will be judged on soldering in accordance with IPC-A-610E Class 3 criteria, the speed at which assembly was produced and overall electrical functionality of assembly.

In conjunction with the soldering competition, Cobar Solder Products will exhibit its SN100C-XF3+ lead-free solder paste and wire, which accommodate extended reflow profiles with or without the use of nitrogen. With XF3+, wetting on all common pad finishings is excellent, yielding shiny joints reminiscent of leaded solders. Additionally, the paste exhibits a robust printing window.

SN100C- XF3+ offers better results for eliminating voiding when compared to any SAC-alloy. The paste provides improved print performance as well as long stencil life. XF3+ allows reflow without N2 and offers a high tack force/time.

Cobar Solder Products is the U.S. division of the Balver Zinn/Cobar Group.

For more information visit: www.cobar.com.


 

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