SMT, PCB Electronics Industry News

AIM to Showcase NC259 Solder Paste at IPC Midwest

Jul 25, 2012

NC259 Solder Paste

NC259 Solder Paste

 AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, will highlight its new NC259 Solder Paste in Booth #603 at the upcoming IPC Midwest Exhibition & Conference, scheduled to take place August 22-23, 2012 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL.

This low-cost, lead-free, halogen-free solder paste offers the performance of tin-lead and high-silver lead-free solder pastes. A virtual drop-in for SAC305, AIM’s NC259 was designed specifically for alloys such as SN100C and SAC0307. NC259 offers excellent print definition and consistent solder volume transfer. Additionally, the paste has proven to eliminate defects such as voiding and head-in-pillow as well as reduce graping on ultra-fine pads. Now, manufacturers can attain the SMT soldering results they require and pay significantly less per gram than with traditional lead-free solder pastes.

Also at the show, AIM will highlight its liquid fluxes, tin-lead and lead-free alloys, including SN100C. SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin, copper, and a small amount of nickel + germanium.

For more information about AIM, visit www.aimsolder.com.


Headquartered in Montreal, Canada, AIM is a leading global manufacturer of assembly materials for the electronics industry.  The company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms, and specialty alloys such as indium and gold for electronics assembly, PC fabrication, component manufacturing and other industries. For more information, visit AIM on the Web at www.aimsolder.com, or e-mail info@aimsolder.com.

Jan 29, 2014 -

AIM Solder Expands Technical Support in Mexico

Jan 10, 2014 -

AIM Solder Announces Appointment of Can Li as Sales Manager of Northern China

Nov 08, 2013 -

AIM’s International Technical Support Manager, Carlos Tafoya, to present at the IPC Conference on Solder and Reliability in Costa Mesa, CA, November 13, 2013

Jul 10, 2013 -

AIM Pleased to be Presented the 2013 Green Supplier Award from Philips Lighting

May 13, 2013 -

AIM Solder Announces the Release of NC277 VOC-free Liquid Flux

May 07, 2013 -

AIM Solder’s NC259 Solder Paste Offers Superior Performance

Apr 30, 2013 -

AIM Solder Announces Appointment of Sales Representative, PHASE 4, Inc.

Apr 25, 2013 -

AIM Solder Announces Appointment of Sales Representative, Rich Sales Co.

Apr 19, 2013 -

AIM Solder Receives Environmental ISO 14001:2004 Certification

Apr 08, 2013 -

AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013

36 more news from AIM Solder »

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

Aug 17, 2017 -

Libra Industries Announces Two 20-Year Service Awards in Q2 2017

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 -

What is SMT and where to by SMT spare parts

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

See electronics manufacturing industry news »

AIM to Showcase NC259 Solder Paste at IPC Midwest news release has been viewed 742 times

Large PCB Dispensing System

Capillary Underfill process