SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Hesse Mechatronics


Hesse & Knipps, Inc. Appoints New Technical Training Manager

Jul 25, 2012

Allan Camp as Technical Training Manager.

Allan Camp as Technical Training Manager.

Hesse & Knipps, Inc., (www.hesse-knipps.com) the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, has appointed Allan Camp as Technical Training Manager.

Allan will provide technical training on Hesse & Knipps’ family of semiconductor packaging equipment including high speed fine pitch wedge bonders and heavy wire bonders. Training will be offered at Hesse & Knipps’ demonstration and applications facilities in Clinton, Mass. and Anaheim, Calif. in addition to on-site at customer facilities. Allan will also conduct demonstrations of Hesse & Knipps wedge bonding equipment and related software, enabling customers to validate and qualify wedge bonders prior to making an investment in new technology.

Allan possesses more than two decades of experience in the semiconductor industry, having most recently worked at Eastman Kodak Company as a microelectronics packaging technician and, previously, at Xerox Corporation as a wafer fab technician. In addition to earning a degree in Electronics Technology, Allan holds a certificate of business degree – management process from Rochester Institute of Technology.

Allan’s knowledge in wafer fab operations, microelectronics packaging and semiconductor processing equipment will serve our customers well as he provides training that addresses their specific wire bonding equipment and manufacturing requirements,” notes Joseph Bubel, president of Hesse & Knipps.

For more information on Hesse & Knipps and its family of wedge bonders, please visit the company’s website at :www.hesse-knipps.com; to view videos of wedge bonding equipment in action, please visit: www.wirebonddemo.com. For more information on Hesse & Knipps’ training programs, e-mail info@hesse-knipps.us.


Hesse & Knipps GmbH Semiconductor Equipment, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon). The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages. 
For more information, please visit the company’s website at www.hesse-knipps.com.

 

You must be a registered user to talk back to us.

More News from Hesse Mechatronics

Jan 24, 2014 -

Hesse Mechatronics Appoints Representative for South America

Oct 31, 2013 -

Hesse Mechatronics to Demonstrate Wedge Wire Bonding Capabilities at Productronica

Jun 07, 2013 -

New Dual-Head Wedge Bonder Makes Americas Debut

May 06, 2013 -

Hesse Mechatronics Launches Heavy Wire and Ribbon Bonding Services for Early Stage Product Development

Apr 13, 2013 -

Hesse Mechatronics, Inc. Appoints Senior Business Development Manager

Mar 06, 2013 -

Hesse & Knipps is now Hesse Mechatronics

Mar 06, 2013 -

Hesse & Knipps is now Hesse Mechatronics.

Sep 04, 2012 -

esse & Knipps Introduces New Extreme Loop Former Bondhead for Heavy Wire Bonders to Support High Density Module Bonding

Aug 14, 2012 -

Hesse & Knipps Appoints CWI Technical Sales as Rep for East Coast United States and Eastern Canada

Aug 02, 2012 -

Hesse & Knipps Appoints Prospect Technical Sales as Rep throughout Northwest United States and Canada

(4) more news from Hesse Mechatronics

Hesse & Knipps, Inc. Appoints New Technical Training Manager news release has been viewed 693 times

PCB Soldering Tools

PCB X-Ray Inspection