SMT, PCB Electronics Industry News

Hesse & Knipps, Inc. Appoints New Technical Training Manager

Jul 25, 2012

Allan Camp as Technical Training Manager.

Allan Camp as Technical Training Manager.

Hesse & Knipps, Inc., (www.hesse-knipps.com) the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, has appointed Allan Camp as Technical Training Manager.

Allan will provide technical training on Hesse & Knipps’ family of semiconductor packaging equipment including high speed fine pitch wedge bonders and heavy wire bonders. Training will be offered at Hesse & Knipps’ demonstration and applications facilities in Clinton, Mass. and Anaheim, Calif. in addition to on-site at customer facilities. Allan will also conduct demonstrations of Hesse & Knipps wedge bonding equipment and related software, enabling customers to validate and qualify wedge bonders prior to making an investment in new technology.

Allan possesses more than two decades of experience in the semiconductor industry, having most recently worked at Eastman Kodak Company as a microelectronics packaging technician and, previously, at Xerox Corporation as a wafer fab technician. In addition to earning a degree in Electronics Technology, Allan holds a certificate of business degree – management process from Rochester Institute of Technology.

Allan’s knowledge in wafer fab operations, microelectronics packaging and semiconductor processing equipment will serve our customers well as he provides training that addresses their specific wire bonding equipment and manufacturing requirements,” notes Joseph Bubel, president of Hesse & Knipps.

For more information on Hesse & Knipps and its family of wedge bonders, please visit the company’s website at :www.hesse-knipps.com; to view videos of wedge bonding equipment in action, please visit: www.wirebonddemo.com. For more information on Hesse & Knipps’ training programs, e-mail info@hesse-knipps.us.


Hesse & Knipps GmbH Semiconductor Equipment, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon). The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages. 
For more information, please visit the company’s website at www.hesse-knipps.com.

 

Jan 24, 2014 -

Hesse Mechatronics Appoints Representative for South America

Oct 31, 2013 -

Hesse Mechatronics to Demonstrate Wedge Wire Bonding Capabilities at Productronica

Jun 07, 2013 -

New Dual-Head Wedge Bonder Makes Americas Debut

May 06, 2013 -

Hesse Mechatronics Launches Heavy Wire and Ribbon Bonding Services for Early Stage Product Development

Apr 13, 2013 -

Hesse Mechatronics, Inc. Appoints Senior Business Development Manager

Mar 06, 2013 -

Hesse & Knipps is now Hesse Mechatronics

Mar 06, 2013 -

Hesse & Knipps is now Hesse Mechatronics.

Sep 04, 2012 -

esse & Knipps Introduces New Extreme Loop Former Bondhead for Heavy Wire Bonders to Support High Density Module Bonding

Aug 14, 2012 -

Hesse & Knipps Appoints CWI Technical Sales as Rep for East Coast United States and Eastern Canada

Aug 02, 2012 -

Hesse & Knipps Appoints Prospect Technical Sales as Rep throughout Northwest United States and Canada

3 more news from Hesse Mechatronics »

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

Aug 17, 2017 -

Libra Industries Announces Two 20-Year Service Awards in Q2 2017

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 -

What is SMT and where to by SMT spare parts

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

See electronics manufacturing industry news »

Hesse & Knipps, Inc. Appoints New Technical Training Manager news release has been viewed 915 times

Facility Closure

SMTA International 2017