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AIMS Harsh Environments Symposium To Address Lead-Free Solders, Materials, Failure Mechanisms and Screening

Jul 24, 2012

 The SMTA announced that the AIMS Harsh Environments Symposium will be held on October 15, 2012 as a focused symposium at SMTA International in Orlando, FL.  The AIMS Harsh Environments Symposium addresses the concerns related to harsh environment electronics and the challenges within the electronics community, with an added emphasis on military and space. It is intended to bring together the needs of "end-users" with the capabilities of the research community and the industrial supply base. Specifically, the Symposium addresses the challenges of meeting expanding temperature ranges (-55C to +150C/+200C) with increased vibration, higher package density and longer reliability. Next generation requirements are explored from the system level and potential supply-based solutions are presented.

Session topics include Pb-Free Solders for Sustained Elevated Temperature Service, Experimental Determination and Modeling of Materials for High Reliability Devices, Testing and Failure Mechanisms in Harsh Operational Environments, and Screening and Prolonged Operation for Harsh Environments.  Papers will be presented by speakers from Agilent Technologies, Auburn University, Indium Corporation, Intel, and University of Rostock among others.

Details of the AIMS Harsh Environments Symposium can be found at http://www.smta.org/smtai/symposium.cfm#he or contact SMTA administrator JoAnn Stromberg: 952-920-7682 or joann@smta.org.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

 

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