SMT, PCB Electronics Industry News

ACD Celebrates 10-Year Partnership with Global Stencil, Inc.

Jul 18, 2012

 ACD, a leading supplier to the electronics industry, announces that it has been working with Global Stencil, Inc. for 10 years. Based in Grand Prairie, Texas, and with support in both Austin and Houston, TX, Global Stencil has been serving the circuit board assembly industry since 1985.

ACD has been working with Global Stencil since the company ramped up its assembly operation. Global Stencil helped ACD become a single-source provider, from new product development to price-conscious boards, box and system-level production. Additionally, Global Stencil educated ACD and its employees about stencil technology and supported the company through its transition to no-touch stencil creation.

Global Stencil, Inc. is committed to achieving a reputation as a supplier whose product, timeliness and service are unsurpassed in the circuit board assembly industry. The company achieves this reputation through planned systematic self-monitoring and continuous improvement.

Global Stencil is a great vendor and has become a fantastic friend in the industry. It is very supportive of our needs and ideas,” said W. Scott Fillebrown, President & CEO.

ACD continues to be a great, loyal customer and continues to push our company to be innovators in the SMT industry with the latest laser technology, stencil design and order processing systems,” commented Greg Smith, President, Global Stencil.

Global Stencil uses the latest fiber laser technology and chemical milling technologies to produce SMT solder paste, stencils, ALPHA TETRABOND™ frameless stencils, step etch stencils, BGAs, rework stencils and ESD inspection templates for the most demanding assembly requirements. For more information about Global Stencil, visit

For more information about ACD, visit

Founded in 1984, ACD is a full service EMS company. The company’s services comprise complete board layout, DFM/DFA capability, printed circuit fabrication, component procurement, thru-hole, SMT and part-on-part mixed technology assembly, box build, rework, flying probe, functional and JTAG test, and development. For more information, visit

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