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Nihon Superior to Exhibit at IPCA INTERNATIONAL EXPO 2012

Jul 10, 2012

SN100C (030)

SN100C (030)

SN100C P810 D4

SN100C P810 D4

SN100CL

SN100CL

Solder-coated aluminum ribbon

Solder-coated aluminum ribbon

 Nihon Superior (Singapore) Pte. Ltd., a subsidiary of Nihon Superior Co. Ltd. and supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of products in booth G2 at the upcoming:

IPCA INTERNATIONAL EXPO 2012, scheduled to take place July 25-27, 2012 in KTPO TRADE CENTRE, WHITEFIELD, in BANGALORE, INDIA.

New product, SN100C P810 D4 is high-reliability lead-free solder paste designed especially for reduction of voids in large-area solder joints such as those between power
semiconductors and their substrates. Voiding is reduced even further with vacuum reflow. SN100C P810 D4 is based on the SN100C alloy that has enjoyed more than a decade of success and innovation providing superior solutions in numerous applications
NEW Development “Replacing Cu with Al”
Solder-coated aluminum ribbon for tabbing of solar cells to take advantage of aluminum’s lower cost and lower density than copper.


SN100CL is silver-free lead-free solder for hot air solder leveling. With its excellent fluidity SN100CL delivers a bright, uniform and bridge-free coating on fine pitch circuitry.  PCB with a hot air solder leveled SN100CL finish exhibit excellent wetting during soldering, with lower copper erosion and the formation of a stable intermetallic layer.

NS-F900 is a robust halogen-free wave soldering flux that delivers excellent wetting even on oxidized copper. It is completely halogen-free, containing no halogens (F, Cl, Br, I), NS-F900 provides excellent wetting up the leads and good drainage in the exit are of the wave to ensure minimal bridging. It is the ideal halogen-free flux for lead-free wave soldering.

SN100C (030) is a high-reliability no-clean flux-cored lead-free solder wire. The wire provides numerous benefits including less tip and pad carbonizing, less flux spatter, less flux residue cracking, fast melting and soldering, good spread, and a substantial cost advantages. Additionally, the wire provides fewer shrinkage defects, reduced copper erosion and a stable intermetalic layer.

For more information about any of the above SN100C products, please visit Nihon Superior in booth G2 at IPCA INTERNATIONAL EXPO 2012.


Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.
 

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