SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Nordson DAGE

Nordson DAGE Named 2012 Best of West Finalist for New X-Plane™ Technology

Jul 02, 2012

 Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), has been selected as a Best of West finalist for its X-Plane™ Analysis – Sub Micron X-Ray Inspection System Option. SEMI and Solid State Technology Magazine will announce the winner of the 2012 Best of West Award Program on Wednesday, July 11, 2012.

X-Plane™ is a revolutionary option for Nordson DAGE’s range of industry-leading X-ray inspection systems that uses a proprietary, patent applied for tomosynthesis, or CT technique, to create 2-D X-ray slices in any plane of a printed circuit board assembly, without the need to cut or destroy the board. In this way, the superior image quality that Nordson DAGE X-ray systems always provide can now be extended into separating individual layers at a level of excellence that the traditional laminography technique cannot achieve. X-Plane™ technology is quick, simple and easy-to-use.

The board is placed in the Nordson DAGE X-ray inspection system and oblique-angled X-ray images are taken 360° around the region of interest. X-Plane™ shows the position and size of voids at joint interfaces and other locations within BGA, CSP, QFN, LGA, etc. Additionally, the technology can identify Head-on-Pillow (HoP) and open joints.

Presented by SEMI and Solid State Technology Magazine, the Best of West Award recognizes important product and technology developments in the microelectronics industries. Winners will be selected by an independent panel of highly qualified judges. Best of West finalists and award recipients will be selected based on the submission’s financial impact on the industry, engineering or scientific achievement, or societal impact and benefits.

Nordson DAGE
Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries.  For more information, visit

Nordson Corporation delivers precision technology solutions that help customers increase speed, productivity and up-time, enable new products and features, and decrease material usage. The company engineers, manufactures and markets differentiated products and systems used for dispensing adhesives, coatings, sealants, biomaterials and other materials, fluid management, testing and inspection, and UV curing and surface plasma treatment, all supported by application expertise and direct global sales and service.  Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, building and construction, and general product assembly and finishing.  Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries.  Visit Nordson at,, or


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