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Panasonic to Show Unique Total Solution Package at Semicon

Jun 20, 2012

Panasonic Factory Solutions Company of America will highlight its unique total package solution for microelectronics manufacturers in booth 6471 at Semicon West at the Moscone Center in San Francisco, CA July 10-12.

Known for world-class quality, innovation, and industry-leading products, systems, and solutions, Panasonic will show booth visitors examples of materials, processes, and manufacturing execution system software solutions. Panasonic’s evolving materials will include a collection of NS-LTCC (Non-Shrink Low Temperature Co-fired Ceramic) and ALIVH (Any Layer Inner Via Hole) substrates enabling fine patterns, high density routing and thinner packaging. Featured process solutions will include the MD-P200, for high-productivity bonding, and plasma solutions for singulation and cleaning. 

Product experts will be on hand to discuss how being a product developer, material supplier, equipment vendor, process expert, manufacturing execution system provider, and leading electronics manufacturer endows Panasonic with incredible value-add for microelectronics manufacturers. Visit www.panasonicfa.com/Semicon12 to get more information.


Panasonic Factory Solutions Company of America, a North American source for electronic assembly equipment (SMT), software and technical support, provides total business systems solutions for electronic semiconductor and packaging companies in the global marketplace through one provider. The company is a unit of Panasonic Corporation of North America, which is the principal North American subsidiary of Panasonic Corporation (NYSE: PC). For additional information: Panasonic Factory Solutions Company of America, 5201 Tollview Drive, Rolling Meadows, IL 60008. PFSAmarketing@us.panasonic.com PH: 847-637-9600. www.panasonicfa.com

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