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SMT, PCB Electronics Industry News

News from Surface Mount Technology Association (SMTA)


SMTA (Surface Mount Technology Association) all day Chapter Meeting at Textron Defense Systems on Tues., June 26, 2012:

Jun 18, 2012

Reliability and Failure Analysis Seminar: Lessons Learned in Manufacturing
Presented by Universal Instruments Corporation’s Advanced Process Laboratory
Hosted by Textron Defense Systems, 201 Lowell St., Wilmington, MA

Universal Instruments Corp’s Advanced Process Laboratory has observed countless failures in electronics manufacturing. From fine pitch printing, to PoP, 01005 chip defects, and high Tg laminate failures. These failures combined with internal research have provided a unique perspective for design for manufacturability and reliability. These lessons will be presented to the class when we discuss material selection, current electronics research, and failure analysis case studies. We will touch on design considerations for many advanced assembly processes as well as discussing types of analytical techniques that can be used for materials characterization.

Technical Presentations will take place in the TDS Mahoney Auditorium
Tours of TDS Product Showcase will be given before presentations start

Agenda will be as follows:

  • 8:00 - 8:30 Registration and Sign-In
  • 8:15 - 9:00 Tours through Textron Product Showcase
  • 9:00 - 9:10 Welcome, Introductions and Review of Agenda
  • 9:10 - 9:45 Presentation: Design-based Transition to Production by Louis Feinstein of Textron
    • Military electronic system design for rapid transition to production
    • Integrated design/supply chain/manufacturing tools and systems
    • Virtualized reliability prediction - Physics of Failure analysis (P.O.F.)
    • Integrated design and production tools and systems
  • 9:45 - 10:45 Presentation: Root Cause Failure Analysis Costs and Benefits by Martin Anselm of UIC
  • 10:45 - 11:00 Morning Break (Coffee and Pastry will be served)
  • 10:45 - 12:00 Presentation: Materials Selection Considerations by Martin Anselm of UIC including:
    • Solder Alloys
    • Laminates
    • Surface Finishes
  • 12:00 - 1:00 Catered Lunch
  • 1:00 - 2:45 Presentation: Failure Analysis tools and Techniques by Martin Anselm of UIC

FA Tools and Techniques to be discussed include the following:

  • Thermogravimetric Analysis & IR - Ion Chromatography - Ion Contamination - Shadow Moire
  • SEM/EDS - Wetting Balance/Solderability - Acoustic Microscopy - White Light Interferometry
  • Mechanical Testing - Optical Microscopy - Mechanical Strain Gauge Analysis & Strain limits
  • X-Ray Inspection – Environmental Testing - Solder Paste Print Transfer Efficiency
  • Micro Hardness Testing - Dye Penetration Testing -Micro Sectioning - Cross-section Etching
  • 2:45 - 3:00 Afternoon Break (Snacks and Refreshments will be served)
  • 3:00 - 4:30 Presentation: Various Case Studies and Q & A by Martin Anselm of UIC
  • 4:30 Meeting Adjourned

Directions to Textron Defense Systems in Wilmington, MA: Take I-95 N / MA-128 N. to I-93 N via EXIT 37B toward CONCORD NH, Go 2.9 miles and Take the RT-129 exit- EXIT 38- toward READING / WILMINGTON, Go 0.2 miles and Keep RIGHT at fork to go on MA-129 / LOWELL ST, & go another 0.9 miles. On left hand side, end up at 201 Lowell St, Wilmington, MA 01887 (Tel.: 978-657-5111).

RSVP: Felicita Dubois at felicita@lightspeedmfg.com  by Fri., June 22nd. Credit Cards will be accepted at time of registration. We accept AMEX, Visa, or Master Card.

Any questions pls. call: Mike Jansen, Chapter President, at Textron Defense Systems, Tel.: (978) 657-1208, Louis Feinstein; Chapter VP of Technical Programs at Textron Defense Systems, Tel.: (978) 657-2123 or Rich Breault, Chapter VP at Lightspeed Manufacturing, Tel.: (978) 521-7676


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