SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from ASKbobwillis.com


Package On Package (PoP) Design and Assembly Center Live

Jun 17, 2012

Tuesday 11th September at 11:30am Eastern Time

Prior to visiting our PoP Design & Assembly Center at SMTA International why not attend our free PoP introductory webinar so you can get an overview of the technology and formulate detailed questions for your visit to this year’s SMTA Int. You can watch the webinar on your PC or arrange a conference room for your engineering team and learn about the latest challenges in manufacture. The webinar is sponsored by GlobalSMT & Packaging magazine.

To book your place just Click Here!   https://www2.gotomeeting.com/register/485844538


SMTA Technical Library on PoP Technology

Visitors to the POP Center will benefit from exclusive access to over 200 technical papers covering Package on Package and stacked packaging technology. This is a unique opportunity to access and learn from one of the largest collection of technical papers made possible by SMTA. "Having worked for many years with SMTA, a worldwide organisation I know the quality of the material and it's great to be able to access this resource for visitors," said Bob Willis, the POP Design & Assembly Center Organiser. Having the opportunity to learn from so many sources will make a company's introduction of POP so much easier. The hundreds of technical papers focus on design, assembly, reliability and so much more.

You must be a registered user to talk back to us.

More News from ASKbobwillis.com

Jan 18, 2017 -

Pin In Hole, Pin in Paste or Selective Reflow CD from Bob Willis

Jan 09, 2017 -

Solder Paste & Stencil Printing Defect Examples Available Royalty FREE

Jan 05, 2017 -

More BGA Defect Examples Available Royalty FREE

Dec 29, 2016 -

QFN LGA Photos for your Training Courses

Dec 29, 2016 -

Conformal Coating Defect Images for Presentations

Dec 12, 2016 -

NPL 2017 Free Webinars are Launched and Chaired by Bob Willis

Nov 10, 2016 -

NPL Future of Interconnection Reliability - The Way Forward

Nov 04, 2016 -

Robotic Iron & Laser Soldering for Lead-Free & High Temperature Alloys webinar

Oct 21, 2016 -

Online Soldering Webinars for All

Sep 06, 2016 -

New NPL Method for Testing Reliability of Electronics in Condensing Environment FREE Webinar

(54) more news from ASKbobwillis.com

Package On Package (PoP) Design and Assembly Center Live news release has been viewed 566 times

Real-time PCB X-ray Inspection System

Essemtec Spider SMT Fluid Dispenser