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  • Engineered Material Systems Debuts UV Cure Adhesive for Disk Drive, Camera Module, Optoelectronic and Circuit Assembly Applications

Engineered Material Systems Debuts UV Cure Adhesive for Disk Drive, Camera Module, Optoelectronic and Circuit Assembly Applications

Jun 05, 2012

 Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, introduces 535-10M-1 UV Cured Adhesive formulated for disk drive  camera module, optoelectronic and circuit assembly applications.

535-10M-1 is an ultra low stress, lower glass transition temperature version of the 535-10M UV Cure Adhesive. The material is designed to eliminate any “crowning” (warpage) of sliders in head gimbal assemblies and can be used in other bonding applications in the head stack assembly. The material also can be used for lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.

This new nonconductive UV cured adhesive cures rapidly when exposed to high-intensity UV light. 535-10M-1 is a low outgassing, extremely flexible, high-strength epoxy adhesive that does not contain antimony. 

The 535-10M-1 was developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications. 535-10M-1 is the latest addition to Engineered Material Systems extensive line of electronic materials..

For more information about the 535-10M-1 UV Curing Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.conductives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.conductives.com.

 

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