SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Engineered Materials Systems, Inc.


Engineered Conductive Materials, LLC Debuts Two New Conductive Grid/Busbar Inks

Jun 05, 2012

New Conductive Grid/Busbar Inks

New Conductive Grid/Busbar Inks

Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, introduces two next-generation conductive grid inks, CI-1031-7 and CI-1031-8, for use in thin-film solar modules. These material formulations have been optimized for excellent conductivity and low contact resistance on transparent conductive oxides used in solar applications. 

The CI-1031-series conductive grid inks have high solids contents and optimized rheologies to enable screen printing of high aspect ratio fine lines to maximize the print thickness and reduce shadowing. These are low stress, low shrinkage thermosetting inks that offer excellent moisture resistance and low polymeric creep. Line resistivity is very low at 8 mΩ/sq/mil (1 mil emulsion; 230 mesh).

CI-1031-7and CI-1031-8 are the latest additions to Engineered Conductive Materials’ full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications, as well as conductive grid inks for photovoltaic applications.

For more information about the CI-1031-7 and CI-1031-8 Conductive Grid Inks or to learn how Engineered Conductive Materials can define, develop and create an engineered material solution that is right for your company, visit www.conductives.com.


Engineered Conductive Materials, LLC (ECM) is a wholly-owned company of Engineered Materials Systems, Inc. (EMS). ECM’s technology focus is electronic circuit fabrication that compliments EMS’s circuit assembly product line. The company creates continual improvements that will guide its customers into the future. For more information, visit www.conductives.com.
 

You must be a registered user to talk back to us.

More News from Engineered Materials Systems, Inc.

Nov 14, 2016 -

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Oct 04, 2016 -

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Smart Card Assembly Applications

Sep 13, 2016 -

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding

Sep 08, 2016 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Aug 08, 2016 -

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Dec 05, 2015 -

Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference

Aug 26, 2015 -

Engineered Materials Systems to Exhibit DF-3000 Series Negative Film Photoresists at SEMI MEMS 2015

Aug 23, 2015 -

Engineered Material Systems Introduces DF-3050 Dry Film Negative Photoresist

Jul 21, 2015 -

Engineered Materials Systems Introduces Low-Cost Snap Cure Conductive Adhesive for Stringing Solar Modules

Jun 17, 2015 -

Engineered Material Systems Introduces DF-3005 Dry Film Negative Photoresist

(40) more news from Engineered Materials Systems, Inc.

Engineered Conductive Materials, LLC Debuts Two New Conductive Grid/Busbar Inks news release has been viewed 927 times

Boundary Scan

PCB Rework / Repair Services