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Cobar Solder Products to Exhibit Leading Technologies at SMTA Upper Midwest Expo & Tech Forum 2012

Jun 01, 2012

SN100C- XF3+

SN100C- XF3+

Cobar  wire

Cobar wire

The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit its lead-free SN100C-XF3+ solder paste and wire at the upcoming SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 7, 2012 from 10 a.m.-3 p.m. at the Hilton Minneapolis/Bloomington Hotel in Bloomington, MN.

Cobar Solder Products’ XF3+ lead-free solder paste accommodates extended reflow profiles with or without the use of nitrogen. With XF3+, wetting on all common pad finishings is excellent, yielding shiny joints reminiscent of leaded solders. It also exhibits a robust printing window.

SN100C- XF3+ performs better in eliminating voiding when compared to any SAC-alloy. XF3+ paste provides improved print performance, as well as long stencil life. It also allows reflow without N2 and offers a high tack force/time.

Cobar Solder Products is the U.S. division of the Balver Zinn/Cobar Group.

For more information visit: www.cobar.com.

 

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