SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Upper Midwest Expo and Tech Forum

MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Upper Midwest Expo and Tech Forum

May 31, 2012

Mini-Oven Reball/Solder Bumping Unit

Mini-Oven Reball/Solder Bumping Unit

MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Upper Midwest Expo & Tech Forum, scheduled to place June 7, 2012 from 10 a.m.-3 p.m. at the Hilton Minneapolis/Bloomington Hotel in Bloomington, MN.

The MINIOVEN 04 provides a reflow environment in a compact, stand-alone unit and is ideal for pre-bumping QFNs and reballing BGAs and CSPs. The efficient hot gas circulation ensures optimal heating of the component and a controlled reflow process. The unit offers programmable modes and accommodates up to 99 profiles, with the ability to edit individual profiles and fine-tune parameters.

A gas connection is available for processing gases, such as nitrogen, argon and formic.

For further information, visit MARTIN at the SMTA Upper Midwest Expo or online at www.bgarework.com.


MARTIN has developed affordable rework, BGA reballing,  hand soldering,  and dispensing technologies for nearly 30 years. The USA sales and service office is located in Manchester, NH. The company‘s manufacturing facility is in Wesseling, Germany. MARTIN is a FINETECH company.

Apr 07, 2016 -

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Nov 27, 2013 -

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 08, 2013 -

Finetech Unveils High Force ACF Bonder

May 28, 2013 -

Al Cabral Joins Finetech as Regional Sales Manager

Mar 11, 2013 -

Donated Finetech Die Bonder Installed at Pennsylvania State University

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Sep 10, 2012 -

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

76 more news from Finetech »

Nov 20, 2017 -

Count On Tools Inc. Receives 2017 Industry of the Year Award

Nov 20, 2017 -

Cogiscan and MIRTEC announce partnership for Industry 4.0

Nov 20, 2017 -

Libra Industries’ Robert Brandt Elevated to IEEE Senior Member

Nov 17, 2017 -

Altus on the Road to Digital Factory of the Future

Nov 17, 2017 -

MicroCare Wins Prestigious Global Technology Award at Productronica 2017

Nov 17, 2017 -

Mycronic and Aegis renew partnership – FactoryLogix software to be embedded with MY700

Nov 16, 2017 -

Europlacer Unveils its New Atom Platform.

Nov 16, 2017 -

Libra Industries installs another 3D post reflow AOI system at its Dallas facility

Nov 16, 2017 -

STI Participates in Manufacturing Day

Nov 16, 2017 -

ZESTRON to Exhibit at SMTA Silicon Valley

See electronics manufacturing industry news »

MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Upper Midwest Expo and Tech Forum news release has been viewed 2443 times

  • SMTnet
  • »
  • Industry News
  • »
  • MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Upper Midwest Expo and Tech Forum
PCB machines

StikNPeel™ Rework Stencils