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MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Upper Midwest Expo and Tech Forum

May 31, 2012

Mini-Oven Reball/Solder Bumping Unit

Mini-Oven Reball/Solder Bumping Unit

MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Upper Midwest Expo & Tech Forum, scheduled to place June 7, 2012 from 10 a.m.-3 p.m. at the Hilton Minneapolis/Bloomington Hotel in Bloomington, MN.

The MINIOVEN 04 provides a reflow environment in a compact, stand-alone unit and is ideal for pre-bumping QFNs and reballing BGAs and CSPs. The efficient hot gas circulation ensures optimal heating of the component and a controlled reflow process. The unit offers programmable modes and accommodates up to 99 profiles, with the ability to edit individual profiles and fine-tune parameters.

A gas connection is available for processing gases, such as nitrogen, argon and formic.

For further information, visit MARTIN at the SMTA Upper Midwest Expo or online at www.bgarework.com.


MARTIN has developed affordable rework, BGA reballing,  hand soldering,  and dispensing technologies for nearly 30 years. The USA sales and service office is located in Manchester, NH. The company‘s manufacturing facility is in Wesseling, Germany. MARTIN is a FINETECH company.

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