SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Upper Midwest Expo and Tech Forum

MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Upper Midwest Expo and Tech Forum

May 31, 2012

Mini-Oven Reball/Solder Bumping Unit

Mini-Oven Reball/Solder Bumping Unit

MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Upper Midwest Expo & Tech Forum, scheduled to place June 7, 2012 from 10 a.m.-3 p.m. at the Hilton Minneapolis/Bloomington Hotel in Bloomington, MN.

The MINIOVEN 04 provides a reflow environment in a compact, stand-alone unit and is ideal for pre-bumping QFNs and reballing BGAs and CSPs. The efficient hot gas circulation ensures optimal heating of the component and a controlled reflow process. The unit offers programmable modes and accommodates up to 99 profiles, with the ability to edit individual profiles and fine-tune parameters.

A gas connection is available for processing gases, such as nitrogen, argon and formic.

For further information, visit MARTIN at the SMTA Upper Midwest Expo or online at www.bgarework.com.


MARTIN has developed affordable rework, BGA reballing,  hand soldering,  and dispensing technologies for nearly 30 years. The USA sales and service office is located in Manchester, NH. The company‘s manufacturing facility is in Wesseling, Germany. MARTIN is a FINETECH company.

Apr 07, 2016 -

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Nov 27, 2013 -

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 08, 2013 -

Finetech Unveils High Force ACF Bonder

May 28, 2013 -

Al Cabral Joins Finetech as Regional Sales Manager

Mar 11, 2013 -

Donated Finetech Die Bonder Installed at Pennsylvania State University

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Sep 10, 2012 -

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

76 more news from Finetech »

Feb 22, 2018 -

KIC demonstrates smart factory technologies with IPC CFX communication at APEX

Feb 22, 2018 -

MicroCare Offers Higher Performance Critical Cleaning Solutions at IPC APEX Booth #2909

Feb 22, 2018 -

Latest Conference Proceedings Now Available in SMTA Knowledge Base

Feb 22, 2018 -

Scienscope to Exhibit Flexible X-ray Component Reel Counter at productronica China

Feb 22, 2018 -

IPC Issues Position Paper on Priorities for an Ambitious EU Industrial Policy Strategy Supports skills gap closure, R&D incentives and strong IP protection

Feb 22, 2018 -

Data Logging: Intelligently and Efficiently

Feb 22, 2018 -

KDPOF Enables Seamless Optical Networks Integration

Feb 22, 2018 -

XJTAG Announces DFT Assistant for Zuken CR-8000 PCB design suite

Feb 21, 2018 -

Joseph Stockunas, Nordson Corporation Corporate VP, Appointed to SEMI Foundation Board of Trustees

Feb 21, 2018 -

VJ Electronix Hires Industry Expert to Continue Strengthening Global Sales and Services

See electronics manufacturing industry news »

MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Upper Midwest Expo and Tech Forum news release has been viewed 2575 times

  • SMTnet
  • »
  • Industry News
  • »
  • MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Upper Midwest Expo and Tech Forum
PCB machines

reflow oven profiler