May 31, 2012 
Upholding its promise to continuously advance thermal profiling technology, ECD has announced the release of M.O.L.E. ® MAP 3.00 (MAP 3.00) software designed to provide even greater levels of machine-assembly-process optimization.
Function-rich and environment-adaptable, MAP 3.00 offers in-depth data and analysis capability within a highly versatile software platform that seamlessly integrates with all ECD profiling hardware. MAP 3.00 allows engineering specialists to utilize ECD sensor inputs to ECD M.O.L.E. thermal profilers for operation within a unique Environment, which is attuned to the specific profiling job. The software switches from one application to the next, allowing effortless transitions between wave soldering and reflow processes.
