SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Rehm Qualifies Void-Free Soldering Process with Viscom X-ray Inspection System

Rehm Qualifies Void-Free Soldering Process with Viscom X-ray Inspection System

May 23, 2012

From left to right: Torsten Pelzer, General Sales Manager Viscom AG, Johannes Rehm, CEO Rehm Thermal Systems GmbH, Volker Pape, Executive Board, Viscom AG

From left to right: Torsten Pelzer, General Sales Manager Viscom AG, Johannes Rehm, CEO Rehm Thermal Systems GmbH, Volker Pape, Executive Board, Viscom AG

 Rehm Thermal Systems GmbH, a supplier of soldering and drying systems with headquarters in Blaubeuren-Seissen, has selected the X8011 X-ray system from Viscom. The transaction was completed during the recent SMT trade fair in Nuremberg.

After various X-ray systems had already been in use at Rehm, the decision was made to invest in its own system for inspecting soldered connections. The X8011 PCB flex X-ray system from Viscom was deployed for process verification in Rehm’s new applications center. Additionally, the company’s goal was to more efficiently further its own investigations into void-free and reliable lead-free soldered connections, especially under vacuum, in order to adapt the products to future customer requirements.

After extensive market research and system tests, Rehm decided on Viscom. Helmut Öttl, head of applications and soldering technology product management at Rehm, has more than 10 years of experience evaluating and operating X-ray systems and knows exactly what is involved: “We had already been using X-ray inspection systems from different suppliers. In our production, even the smallest air inclusions must be reliably detected. With its high detail accuracy and good contrast, the X8011 is ideally suited to do so. Simple operation and convenient handling in the everyday operations of the applications center also are important because there is little time to obtain the optimum image, especially during customer visits. This was another big selling point of  the X8011 from Viscom.”

Mar 07, 2013 -

Semikron Checks DCBs with Automatic Wirebond AOI from Viscom

Mar 07, 2013 -

Viscom Scores NPI Award for Its SPI-AOI Uplink Function

Feb 21, 2013 -

Viscom presents new XM camera module for extreme cycle times and highest inspection depth

Jan 17, 2013 -

Viscom to Debut S6056 XM AOI with New 65 Megapixel Camera Head at the IPC APEX EXPO

Oct 15, 2012 -

Viscom Semiautomatic X-ray Inspection Now Offers High-Performance Verification Linkage

Oct 11, 2012 -

Manufacture with Confidence – Combined Optical and X-ray Inspection from Viscom

Sep 14, 2012 -

Viscom AG Obtains “Authorized Economic Operator” Status

Sep 13, 2012 -

Viscom to Exhibit AOI/AXI Capabilities and New Process Uplink at SMTA International 2012

Aug 23, 2012 -

Smyczek Optimizes SMT Processes with Viscom 3D-SPI Process Uplink

Jul 26, 2012 -

Viscom Strengthens Its Manual and Semiautomatic Inspection for the Electronics Industry

2 more news from Martel Marketing Communications, Inc. »

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

Aug 17, 2017 -

Libra Industries Announces Two 20-Year Service Awards in Q2 2017

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 -

What is SMT and where to by SMT spare parts

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

See electronics manufacturing industry news »

Rehm Qualifies Void-Free Soldering Process with Viscom X-ray Inspection System news release has been viewed 959 times

  • SMTnet
  • »
  • Industry News
  • »
  • Rehm Qualifies Void-Free Soldering Process with Viscom X-ray Inspection System
Metcal soldering rework

Reflow Ovens thermal process improvement