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Rehm Qualifies Void-Free Soldering Process with Viscom X-ray Inspection System

May 23, 2012

From left to right: Torsten Pelzer, General Sales Manager Viscom AG, Johannes Rehm, CEO Rehm Thermal Systems GmbH, Volker Pape, Executive Board, Viscom AG

From left to right: Torsten Pelzer, General Sales Manager Viscom AG, Johannes Rehm, CEO Rehm Thermal Systems GmbH, Volker Pape, Executive Board, Viscom AG

 Rehm Thermal Systems GmbH, a supplier of soldering and drying systems with headquarters in Blaubeuren-Seissen, has selected the X8011 X-ray system from Viscom. The transaction was completed during the recent SMT trade fair in Nuremberg.

After various X-ray systems had already been in use at Rehm, the decision was made to invest in its own system for inspecting soldered connections. The X8011 PCB flex X-ray system from Viscom was deployed for process verification in Rehm’s new applications center. Additionally, the company’s goal was to more efficiently further its own investigations into void-free and reliable lead-free soldered connections, especially under vacuum, in order to adapt the products to future customer requirements.

After extensive market research and system tests, Rehm decided on Viscom. Helmut Öttl, head of applications and soldering technology product management at Rehm, has more than 10 years of experience evaluating and operating X-ray systems and knows exactly what is involved: “We had already been using X-ray inspection systems from different suppliers. In our production, even the smallest air inclusions must be reliably detected. With its high detail accuracy and good contrast, the X8011 is ideally suited to do so. Simple operation and convenient handling in the everyday operations of the applications center also are important because there is little time to obtain the optimum image, especially during customer visits. This was another big selling point of  the X8011 from Viscom.”

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