SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Nordson DAGE to Exhibit Hot Bump Pull/Hot Pin Pull Technology at ECTC San Diego

Nordson DAGE to Exhibit Hot Bump Pull/Hot Pin Pull Technology at ECTC San Diego

May 01, 2012

4000Plus Bondtester Pad Cratering Inspection System

4000Plus Bondtester Pad Cratering Inspection System

 Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit its 4000Plus Bondtester Pad Cratering Inspection System in Booth #212 at the upcoming Electronic Components and Technology Conference (ECTC), scheduled to take place May 29-June 1, 2012 at the Sheraton San Diego Hotel and Marina in California.

The new Nordson DAGE 4000Plus Hot Bump Pull/Hot Pin Pull system is a unique patented technique for attaching a test probe to solder bumps or solder paste in order to perform a hot bump pull test. The industry unique solution conforms to IPC-9708 as well as JEITA ET-7407A test standards for the detection of pad cratering for surface mount and printed circuit board assemblies. It is fully integrated into a single load cartridge on a standard 4000Plus system. Heating and cooling stages and a pin clamping mechanism are integrated into the single load cartridge.

The 4000Plus Bondtester represents the new industry standard in bond testing with unsurpassed data accuracy and repeatability. Nordson DAGE bond test technology meets the requirements of emerging test applications including ribbon pull, pad cratering using hot pin pull, bend and fatigue testing. The 4000Plus bondtester uses the next-generation Paragon™ software providing semiautomatic test routines, automatic GR&R calculation, unique database search engine wizard and superior data reporting.

For more information, visit www.nordsondage.com.


Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries.  For more information, visit www.nordsondage.com.

Nordson Corporation delivers precision technology solutions that help customers increase speed, productivity and up-time, enable new products and features, and decrease material usage. The company engineers, manufactures and markets differentiated products and systems used for dispensing adhesives, coatings, sealants, biomaterials and other materials, fluid management, testing and inspection, and UV curing and surface plasma treatment, all supported by application expertise and direct global sales and service.  Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, building and construction, and general product assembly and finishing.  Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries.  Visit Nordson at www.nordson.com, twitter.com/Nordson_Corp, or Facebook.com/Nordson.

 

May 02, 2018 -

Quadruple Industry Recognition for Nordson DAGE Test and Inspection systems at Nepcon China 2018

Mar 21, 2018 -

Nordson DAGE announce the launch of Paragon™ Materials software

Feb 26, 2018 -

Maintenance-Free X-ray Inspection Now Available for PCBA Production Applications

Oct 24, 2017 -

Nordson DAGE Announce 2017 European X-ray Distributor Award Winners

Oct 17, 2017 -

Nordson Test & Inspection Announces Lineup for productronica

Oct 12, 2017 -

Nordson DAGE to Discuss Its Wafer X-ray Metrology Platform at IWLPC

Sep 12, 2017 -

Nordson Brings its Flagship Inspection Systems to SMTAI

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 15, 2017 -

Nordson Brings Its Flagship Inspection Systems to SMTAI

Jun 13, 2017 -

Nordson Showcases Its Market-Leading Test and Inspection Systems at SEMICON West

111 more news from Nordson DAGE »

May 25, 2018 -

Saelig Introduces LoRa/FSK Smart Modem Transceiver For Long Range Control

May 25, 2018 -

Allchips won 10 million of A Round Investment in January 2018

May 24, 2018 -

DOVER CORPORATION SELECTS OK INTERNATIONAL – CYPRESS AS AN INAUGURAL WINNER OF THE DOVER SAFETY EXCELLENCE AWARD

May 24, 2018 -

DOVER CORPORATION SELECTS OK INTERNATIONAL – CYPRESS AS AN INAUGURAL WINNER OF THE DOVER SAFETY EXCELLENCE AWARD

May 24, 2018 -

CyberOptics Demonstrates Advanced Airborne Particle Sensing Technology at SEMICON West

May 23, 2018 -

Koh Young, the 3D Inspection Market Leader, Reports Strong Quarterly Results Again

May 22, 2018 -

Metcal Is Reinventing Hand Soldering – Learn More at the SMTA Upper Midwest Expo

May 22, 2018 -

Europlacer to Show Full Assembly Line Products & Solutions at SMT Nuremberg.

May 22, 2018 -

IPC Releases Additional Test Coupons for the IPC-2221B Gerber Coupon Generator Test Coupons provide structural integrity verification based on current printed board design technology

May 22, 2018 -

Specialized Coating Services Hosts Successful Open House for New Billerica Facility

See electronics manufacturing industry news »

Nordson DAGE to Exhibit Hot Bump Pull/Hot Pin Pull Technology at ECTC San Diego news release has been viewed 1295 times

  • SMTnet
  • »
  • Industry News
  • »
  • Nordson DAGE to Exhibit Hot Bump Pull/Hot Pin Pull Technology at ECTC San Diego
Plasma Prior to Conformal Coating

Plasma prior Conformal Coating