SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • IPC TECHNOLOGY TRENDS STUDY REVEALS CHANGES IN STORE FOR PCB FABRICATORS AND SUPPLIERS

IPC TECHNOLOGY TRENDS STUDY REVEALS CHANGES IN STORE FOR PCB FABRICATORS AND SUPPLIERS

Apr 27, 2012

 PCB Technology Trends 2011, a new study published this week by IPC — Association Connecting Electronics Industries®, shows how the demands of miniaturization and high-speed technology are driving changes in printed circuit board (PCB) processes and materials. The 53-page report presents the technology demands of today and foretells the changes expected by 2014 that will affect PCB fabricators as well as materials and equipment suppliers.


IPC’s PCB technology trends study was conducted in late 2011 in English and Chinese. Forty-one PCB manufacturing companies participated, including many of the leading companies in Asia, Europe and North America. They represent 16.5 percent of the world PCB market. The IPC study sample is representative of the global industry in terms of company size and product mix.


Between 2011 and 2014, high-density interconnect (HDI) board production is expected to grow 26 percent for the companies that participated in IPC’s PCB Technology Trends study. They also anticipate greater use of stacked and staggered microvias, leading to any-layer microvias and “via anywhere” capability. While miniaturization and the demands of high-speed technology are driving these trends, companies cite solder mask registration and assembly as the two most common factors limiting the miniaturization of circuitry dimensions.


Most of the companies are evaluating new surface finishes, especially electroless nickel, immersion palladium and immersion gold (ENIPIG). The report also confirms that the high price of gold is having an impact on changes in PCB processing, with nearly one-quarter of the participants trying alternative metals. Seventeen percent of respondents are trying to use reduced thicknesses of gold, including some who claim that the price of gold is having no impact on their material selection.


Of the two primary substrate materials used today, multi-function epoxy resin is expected to grow to be used in more than half of panel area produced by 2014, while the use of glass fabric is expected to decline. Companies’ data on laminates used today along with forecasts for 2014 show laminates moving toward higher-temperatures thermal properties. They also predict the use of more low-loss materials. It is expected that by 2014 nearly half of the panel area produced will be halogen free and nearly three-quarters will be lead free.


The industry anticipates significant increases in the production of hybrids or modules, and in the use of printed electronics and optical technology in producing printed boards by 2014.


PCB Technology Trends 2011 is available free to companies that participated in the survey. Other companies may purchase the report by visiting IPC’s online store at www.ipc.org/pcb-tech-trends-2011. The price for IPC members is $675 and the standard price is $1350. The report will also be published in Chinese next month.


IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.
 

Nov 13, 2017 -

New Software Toolkit, CFX Messaging Library Expedites Connected Factory Exchange Implementation

Nov 13, 2017 -

Ventec International Group Receives IPC-4101 Qualified Products Listing Certification

Nov 07, 2017 -

IPC Releases G Revisions of Two Widely Used Standards, IPC-A-610 and IPC J-STD-001

Oct 30, 2017 -

IPC Pulse Survey Reveals Bullish Outlook for Equipment and PCB Manufacturers

Oct 26, 2017 -

IPC Hand Soldering Competition Winner Crowned at ELECTROSUB 2017 in Budapest

Oct 18, 2017 -

IPC Hand Soldering Competition Winner Crowned at IFTEC in Paris

Oct 17, 2017 -

PCB Prototype Sales Trends Often Diverge from PCB Market Trends According to New IPC Report

Oct 17, 2017 -

IPC APEX EXPO 2018 Educational Programs Highlight Technology’s Accelerating Speed of Change Registration Now Open, Show Floor More than 95% Sold

Oct 11, 2017 -

Nate Carson Joins IPC as New Director of Business Development

Oct 05, 2017 -

IPC Releases 2017 Quality Benchmark Study for Electronics Assembly

863 more news from Association Connecting Electronics Industries (IPC) »

Nov 17, 2017 -

Altus on the Road to Digital Factory of the Future

Nov 17, 2017 -

MicroCare Wins Prestigious Global Technology Award at Productronica 2017

Nov 17, 2017 -

Mycronic and Aegis renew partnership – FactoryLogix software to be embedded with MY700

Nov 16, 2017 -

Europlacer Unveils its New Atom Platform.

Nov 16, 2017 -

Libra Industries installs another 3D post reflow AOI system at its Dallas facility

Nov 16, 2017 -

STI Participates in Manufacturing Day

Nov 16, 2017 -

ZESTRON to Exhibit at SMTA Silicon Valley

Nov 16, 2017 -

Comet Group Receives 2017 Global Technology Award for Test Services at Lab One

Nov 15, 2017 -

WKK Distribution Honored as Best Asian Distributor

Nov 15, 2017 -

KYZEN, the Leader in Cleaning Innovation, Receives Its 60th Industry Award

See electronics manufacturing industry news »

IPC TECHNOLOGY TRENDS STUDY REVEALS CHANGES IN STORE FOR PCB FABRICATORS AND SUPPLIERS news release has been viewed 846 times

  • SMTnet
  • »
  • Industry News
  • »
  • IPC TECHNOLOGY TRENDS STUDY REVEALS CHANGES IN STORE FOR PCB FABRICATORS AND SUPPLIERS
 Reflow System

SMT Prototype Stencils - BEST, Inc.