SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Toronto Expo and Tech Forum

MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Toronto Expo and Tech Forum

Apr 19, 2012

 Mini-Oven Reball/Solder Bumping Unit

MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Toronto Expo & Tech Forum, scheduled to take place May 16, 2012 from 10 a.m.-3 p.m. at the Crowne Plaza Toronto Airport Hotel in Ontario, Canada.

The MINIOVEN 04 provides a reflow environment in a compact, standalone unit and is ideal for pre-bumping QFNs and reballing BGAs and CSPs.  The efficient hot gas circulation ensures optimal heating of the component and a controlled reflow process. The unit offers programmable modes and will accommodate up to 99 profiles, with the ability to edit individual profiles and fine tune parameters.
A gas connection is available for processing gases, such as nitrogen, argon and formic.

For further information, visit MARTIN at the SMTA Toronto Expo or online at www.bgarework.com.


MARTIN has developed affordable rework, BGA reballing,  hand soldering,  and dispensing technologies for nearly 30 years. The USA sales and service office is located in Manchester, NH.  The company‘s manufacturing facility is in Wesseling, Germany.  MARTIN is a FINETECH company.

Apr 24, 2013 -

MARTIN Introduces IR Temperature Measurement Sensors for ENHANCED Rework

Jan 20, 2012 -

MARTIN to Demonstrate Affordable Rework Solutions at the 2012 IPC APEX Expo

Oct 07, 2011 -

MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at SMTA LA/Orange County Expo

Sep 19, 2011 -

MARTIN to Demonstrate Affordable Rework System and Mini-Oven Reball/PreBump Unit at SMTAI 2011

Jul 27, 2011 -

LEDs Are Well On The Way To Becoming The Most Innovative Components With The Fastest Growth Rate

May 10, 2011 -

MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Space Coast Expo & Tech Forum

Apr 07, 2011 -

MARTIN Launches Web Site for North American Market

Jun 25, 2017 -

Libra Industries’ Christopher R. Howell Memorial Foundation Awards $20,000 in Scholarships during Annual Golf Outing

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

Jun 25, 2017 -

Ersa Brings the ‘Little Big One’ to SMTA Ohio – Award-Winning Selective Solder

Jun 25, 2017 -

Optimal Electronics Releases Process Control and Traceability Solution for Nordson ASYMTEK Applications in Clean Rooms for Sensor Assembly

Jun 25, 2017 -

Inovaxe Partners with Repstronics in Mexico

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

Jun 22, 2017 -

Addressing The Modulation of Light Output -- High Quality LED Manufacturing

Jun 22, 2017 -

Schleuniger, Inc. Receives 2017 Best of Manchester Award

Jun 21, 2017 -

Inovar Inc. Breaks Ground for New Facility on USU Innovation Campus

Jun 21, 2017 -

PNC Inc. Launches Design Webinar Series

See electronics manufacturing industry news »

MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Toronto Expo and Tech Forum news release has been viewed 1247 times

  • SMTnet
  • »
  • Industry News
  • »
  • MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Toronto Expo and Tech Forum
PCB machines

PCB Assembly Equipment Auctions