SMT, PCB Electronics Industry News

AIM to Highlight NC259 No-Clean Solder Paste at NEPCON China 2012

Apr 17, 2012

 NC259 No-Clean Solder Paste

AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, will highlight its NC259 no-clean solder paste chemistry in Booth #1A02 at the upcoming NEPCON China 2012. The event is scheduled to take place April 25-27, 2012 at the Shanghai World Expo Exhibition & Convention Center.

NC259 solder paste has been developed in response to many issues that manufacturers face daily. It is the first low-cost, lead-free, halogen-free solder paste to offer the performance of tin-lead and high-silver lead-free solder pastes. Now, manufacturers can attain the SMT soldering results they require and pay significantly less per gram than with traditional lead-free solder pastes. The ability of NC259 to eliminate head-in-pillow failures is critical as the use of leadless devices such as BGAs and QFNs increase.

Additionally, AIM will highlight its liquid fluxes, tin-lead and lead-free alloys, including SN100C. SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin, copper, and a small amount of nickel + germanium.

For more information, meet company representatives in Booth #1A02 at the show or visit www.aimsolder.com.


Headquartered in Montreal, Canada, AIM is a leading global manufacturer of assembly materials for the electronics industry.  The company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms, and specialty alloys such as indium and gold for electronics assembly, PC fabrication, component manufacturing and other industries. For more information, visit AIM on the Web at www.aimsolder.com, or e-mail info@aimsolder.com.

Jan 29, 2014 -

AIM Solder Expands Technical Support in Mexico

Jan 10, 2014 -

AIM Solder Announces Appointment of Can Li as Sales Manager of Northern China

Nov 08, 2013 -

AIM’s International Technical Support Manager, Carlos Tafoya, to present at the IPC Conference on Solder and Reliability in Costa Mesa, CA, November 13, 2013

Jul 10, 2013 -

AIM Pleased to be Presented the 2013 Green Supplier Award from Philips Lighting

May 13, 2013 -

AIM Solder Announces the Release of NC277 VOC-free Liquid Flux

May 07, 2013 -

AIM Solder’s NC259 Solder Paste Offers Superior Performance

Apr 30, 2013 -

AIM Solder Announces Appointment of Sales Representative, PHASE 4, Inc.

Apr 25, 2013 -

AIM Solder Announces Appointment of Sales Representative, Rich Sales Co.

Apr 19, 2013 -

AIM Solder Receives Environmental ISO 14001:2004 Certification

Apr 08, 2013 -

AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013

36 more news from AIM Solder »

May 23, 2018 -

Koh Young, the 3D Inspection Market Leader, Reports Strong Quarterly Results Again

May 22, 2018 -

Metcal Is Reinventing Hand Soldering – Learn More at the SMTA Upper Midwest Expo

May 22, 2018 -

Europlacer to Show Full Assembly Line Products & Solutions at SMT Nuremberg.

May 22, 2018 -

IPC Releases Additional Test Coupons for the IPC-2221B Gerber Coupon Generator Test Coupons provide structural integrity verification based on current printed board design technology

May 22, 2018 -

Specialized Coating Services Hosts Successful Open House for New Billerica Facility

May 22, 2018 -

Koh Young Continues to Strengthen its Support Network for the Americas

May 21, 2018 -

Naprotek, Inc. Installs Flexible New MXI System

May 21, 2018 -

Ersa Holds National Sales Meeting with Hands on Training

May 21, 2018 -

New Lightweight Cartridge Applicators from Techcon

May 21, 2018 -

KIC to Discuss Closing the Loop at SMT/Hybrid/Packaging

See electronics manufacturing industry news »

AIM to Highlight NC259 No-Clean Solder Paste at NEPCON China 2012 news release has been viewed 1196 times

BGA Rework Services

fluid dispensing pumps for integration