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Engineered Conductive Materials Introduces Spot Curing Conductive Adhesive DB-1590

Apr 13, 2012

Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, debuts the fast  curing conductive adhesive DB-1590 for use as a solder replacement in next-generation crystalline silicon solar modules using thinned silicon and/or plated bus bars. This material formulation has been optimized for excellent conductivity and stability on various substrates when cured at 200°C.

DB-1590 is designed to gel in five seconds or less at 200°C, developing sufficient strength to withstand the applied stresses induced by the manufacturing process until the adhesive cure is completed during the encapsulant lamination process. DB-1590 has optimized rheology for dispensing, excellent damp heat resistance and conductivity stability on tin, tin-silver and silver-plated ribbons. DB-1590 also is stable on OSP treated copper and nickel bus bars. The DB-1590 features a rubber-like flexibility that is ideal for flexible photovoltaic applications.

DB-1590 is the latest addition to Engineered Conductive Materials’ full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications, as well as conductive grid inks for photovoltaic applications.

For more information about the DB-1590 Conductive Adhesive or to learn how Engineered Conductive Materials can define, develop and create an engineered material solution that is right for your company,  visit www.conductives.com.


Engineered Conductive Materials, LLC (ECM) is a wholly-owned company of Engineered Materials Systems, Inc. (EMS). ECM’s technology focus is electronic circuit fabrication that compliments EMS’s circuit assembly product line. The company creates continual improvements that will guide its customers into the future. For more information, visit www.conductives.com.

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