SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • New Low-Temperature Curing Conductive Adhesive Available for OLEDs and OPVs

New Low-Temperature Curing Conductive Adhesive Available for OLEDs and OPVs

Apr 05, 2012

Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, introduces the low-temperature curing Conductive Adhesive DB-1541-LTC for use in organic light emitting diodes (OLED) and organic photovoltaics (OPV). This material formulation has been optimized for excellent conductivity and stability on various substrates when cured at 100°C or higher.

The DB-1541-LTC can be cured as low as 100°C, but has a dispensing work life greater than 48 hours (measured as a 25 percent increase in viscosity), while maintaining optimized rheology for dispensing and excellent damp heat resistance and conductivity stability on tin, tin-silver and silver-plated ribbons. The DB-1541-LTC features a rubber-like flexibility that is ideal for flexible applications with high peel strength to withstand the stresses induced in reel-to-reel manufacturing processes. This material also can be fast cured at elevated temperatures (1min @ 180°C)

DB-1541-LTC is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives focused on photovoltaic, LED and circuit assembly applications.

For more information about the DB-1541-LTC Conductive Adhesive or to learn how Engineered Conductive Materials can define, develop and create an engineered material solution that is right for your company, visit www.conductives.com.


Engineered Conductive Materials, LLC (ECM) is a wholly-owned company of Engineered Materials Systems, Inc. (EMS). ECM’s technology focus is electronic circuit fabrication that compliments EMS’s circuit assembly product line. The company creates continual improvements that will guide its customers into the future. For more information, visit www.conductives.com.

Apr 13, 2012 -

Engineered Conductive Materials Introduces Spot Curing Conductive Adhesive DB-1590

Mar 27, 2024 -

Red Glue SMT Solutions: A Cost-Effective Approach for Double-Sided PCBs

Mar 26, 2024 -

North American PCB Industry Sales Down 11.6 Percent in February

Mar 26, 2024 -

iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs

Mar 26, 2024 -

Don Dennison Appointed to Roll Out KIC's Latest Thermal Analysis System Software in the Northeast

Mar 26, 2024 -

Altus Group Achieves Record Sales Milestone with Koh Young Europe

Mar 26, 2024 -

STI Welcomes Edrick Young as the Newest Mechanical Assembly Technician

Mar 26, 2024 -

Anda Technologies Receives 2024 NPI Award for Setting a New Standard in Smart Manufacturing

Mar 26, 2024 -

ZESTRON's Olaf Schoenfeld, Ph.D. to Participate in EV Special Session at IPC APEX Expo

Mar 26, 2024 -

North American EMS Industry Up 4.1 Percent in February

Mar 26, 2024 -

SMTA Europe Announces 2024 Spring Conferences

See electronics manufacturing industry news »

New Low-Temperature Curing Conductive Adhesive Available for OLEDs and OPVs news release has been viewed 1086 times

  • SMTnet
  • »
  • Industry News
  • »
  • New Low-Temperature Curing Conductive Adhesive Available for OLEDs and OPVs
Solder Paste Dispensing

Reflow Oven