IPC CONFERENCE IN BUDAPEST BOOMS WITH DOUBLE-DIGIT GROWTH

Apr 05, 2012

IPC’s second annual Conference on Electronics Assembly: Soldering, Assembly & Inspection, held in Budapest, Hungary last month saw an increase of 21 percent in attendees and a 44 percent increase in exhibitors over its inaugural event last year. The conference brought together industry experts from across Europe to discuss new technologies and trends in electronics manufacturing.

“The increased participation in 2012 reflects the high energy and growth in this region,” says Tony Hilvers, IPC vice president of industry programs. “IPC is excited to support this growth and promote networking and technical education through our conference.”

The event included half-day workshops conducted by EMS experts Bob Willis, ASKBobWillis.com, and Lars Wallin, IPC’s European representative. In addition, a two-day conference featured technical presentations on the latest research from all aspects of the electronics manufacturing supply chain. The keynote address “Reliability of Lead-Free Solder Interconnection for Electronics Assembly,” was delivered by Dr. Hao Yu, senior specialist, IC Packaging and Interconnection Reliability, Mobile Phones, Nokia GmbH.

For details on exhibiting in 2013, contact Maria Labriola, IPC manager of trade show sales, at +1 847-597-2866 or MariaLabriola@ipc.org, or Lars Wallin, IPC European representative, at +46 8 26 10 07 or LarsWallin@ipc.org.


IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.

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