SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Henkel Chipbonder Compatible with Non-Contact Dispensing Technology; Enables Higher Throughput and More Uniform Dot Dimensions

Henkel Chipbonder Compatible with Non-Contact Dispensing Technology; Enables Higher Throughput and More Uniform Dot Dimensions

Apr 04, 2012

 Known worldwide for surface-mount adhesive (SMA) development leadership, Henkel has set the industry benchmark with its high-performance Chipbonder brand adhesives.  Within the company’s expansive portfolio of SMAs is LOCTITE 3621, which has been validated for use with non-contact dispensing – often referred to as jetting – technologies. This capability makes the SMA even more ideal for high-volume production environments.

The majority of SMAs are needle dispensed which, although adequate for many applications, does have limitations in terms of speed, as well as dot shape and size.  LOCTITE 3621’s unique rheology makes it well-suited for non-contact dispensing processes, which helps alleviate some of the drawbacks with traditional needle dispensing.  Using LOCTITE 3621, non-contact dispense speed is nearly four times faster as compared to needle dispense techniques.  With a small dot size (350µ/0.014” and larger), dots per hour (DPH) of up to 40,000  can be achieved with non-contact dispensing as compared to an average of 10,000 DPH with alternative methods.

Though LOCTITE 3621 can be utilized in either traditional needle dispensing or non-contact dispensing systems, customers are increasingly migrating to higher throughput options,” notes Tom Adcock, Henkel Electronic Materials Global Product Manager for Assembly Adhesives.  “The speed and dot consistency available with LOCTITE 3621 allows higher yields at faster production rates – which are often the metrics of operational efficiency.”

In addition to its sheer speed advantage, LOCTITE 3621 non-contact dispensing SMA also provides for more uniform dot dimensions and volume repeatability.  Needle dispense techniques are often prone to tailing or stringing, which can result in contamination of the solder pads and, ultimately, a poor interconnect.    Non-contact dispensed LOCTITE 3621 eliminates this concern, as it there is no tailing or stringing, dot dimensions are more spherical and dot to dot consistency is far better as compared to alternative deposition methods.  Other notable advantages of LOCTITE 3621 include the material’s lead-free wave compatibility, excellent green (wet) strength, fast cure capability of 120 seconds at 150°C and long shelf life of one month at room temperature and ten months under refrigerated storage conditions. 

Consistent with Henkel’s innovation philosophy, LOCTITE 3621 delivers high performance in a supremely adaptable and cost-effective material system,” concludes Adcock.  “With this material, speed and strength are not mutually exclusive!”

For more information on LOCTITE 3621 or any of Henkel’s next-generation Chipbonder SMAs, log onto www.henkel.com/electronics or call the company’s customer and product support center at 
1-888-943-6535.


Henkel operates worldwide with leading brands and technologies in three business areas: Laundry & Home Care, Cosmetics/Toiletries and Adhesive Technologies. Founded in 1876, Henkel holds globally leading market positions both in the consumer and industrial businesses with well-known brands such as Persil, Schwarzkopf and Loctite. Henkel employs more than 47,000 people and reported sales of $21.7 billion and adjusted operating profit of $2.8 billion in fiscal 2011. Henkel’s preferred shares are listed in the German stock index DAX and the company ranks among the Fortune Global 500.

Mar 16, 2018 -

Henkel Develops Non-Proprietary Solder Paste Analysis Toolkit for Modern Process Complexities

Jan 31, 2018 -

Henkel to debut new materials, share expertise at IPC APEX Expo 2018

Mar 06, 2017 -

TECHNOMELT AS 8998 Masking Material Producing Measurable Gains in Efficiency, Cost Control; Recognized with Industry Award

Mar 01, 2017 -

Steven Abramovich Appointed Head of Sales, Americas for Henkel’s Electronics Business

Feb 23, 2017 -

Water Soluble, Tin-Lead Solder Paste from Henkel Enables High-Yield Results for Demanding Applications

Jan 24, 2017 -

Henkel to Showcase Broad Range of Enabling Electronic Materials at IPC APEX Expo 2017

Sep 21, 2016 -

Broad Portfolio of Henkel Enabling Technologies on Show at SMTA International 2016

May 11, 2016 -

Henkel Honors Manufacturing Representative, E-Tronix, with its Fifth North American Representative of the Year Award

May 09, 2016 -

Henkel Partners with Tekra to Expand Coverage of its Electronic Inks Business in North America

Mar 30, 2016 -

Henkel Develops Thermally Conductive Technomelt® Solution

50 more news from Henkel Electronic Materials »

Apr 18, 2024 -

ViTrox Technologies Elevates Service & Support Across US & Canada with Jeremy Woodworth's Appointment!

Apr 16, 2024 -

I.C.T | Your One-Stop Service for Smart Meter SMT Factory

Apr 15, 2024 -

Three Industry Leaders Receive IPC President's Award

Apr 15, 2024 -

IFTEC's Pierre-Jean Albrieux Inducted into the IPC Raymond E. Pritchard Hall of Fame at IPC APEX EXPO 2024

Apr 15, 2024 -

IPC Honors Summit Interconnect and Robert Bosch GmbH with Corporate Recognition Awards

Apr 15, 2024 -

IPC Publishes Comprehensive Strategy to Address Electronics Industry's Global Workforce Challenge, Calls on Leaders in Government, Business and Education for Support

Apr 15, 2024 -

Data I/O Announces Major Milestone with 500th PSV System Sale Ahead of IPC APEX Expo

Apr 15, 2024 -

IPC Announces New Board Members at IPC APEX EXPO 2024

Apr 15, 2024 -

Seika Machinery Recognizes Outstanding Sales Achievements at 2024 IPC APEX EXPO

Apr 15, 2024 -

IPC Releases "J" Revisions to Two Leading Standards for Electronics Assembly

See electronics manufacturing industry news »

Henkel Chipbonder Compatible with Non-Contact Dispensing Technology; Enables Higher Throughput and More Uniform Dot Dimensions news release has been viewed 1460 times

  • SMTnet
  • »
  • Industry News
  • »
  • Henkel Chipbonder Compatible with Non-Contact Dispensing Technology; Enables Higher Throughput and More Uniform Dot Dimensions
ICT Total SMT line Provider

See Your 2024 IPC Certification Training Schedule for Eptac