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Engineered Material Systems Debuts New 535-10M UV Cure Adhesive for Disk Drive Applications

Apr 03, 2012

Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, introduces its 535-10M UV Cured Epoxy formulated for disk drive, camera module, optoelectronics and circuit assembly applications.

This new non-conductive UV cured adhesive cures rapidly when exposed to high intensity UV light. 535-10M is a low outgassing, flexible, high strength epoxy adhesive that does not contain antimony. 

The 535-10M was developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications. 535-10M is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

For more information about the 535-10M UV Cured Epoxy or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.conductives.com.


About Engineered Material Systems
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.conductives.com.

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